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31 - 40 of 5,064 results
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4311S20-IR
THAT Corporation
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Check for Price | Contact Manufacturer | 7 V | BIPOLAR | BASEBAND CIRCUIT | 1 | 9 mA | COMMERCIAL | R-PDSO-G20 | Not Qualified | 70 °C | -20 °C | 20 | PLASTIC/EPOXY | SSOP | SOP20,.25,40 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | THAT CORP | SSOP, SOP20,.25,40 | unknown | 8542.39.00.01 | ||||||||||||||||||
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CV210-1
TriQuint Semiconductor
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Check for Price | Transferred | 5.5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | QUAD | 6 mm | 6 mm | 1 mm | TRIQUINT SEMICONDUCTOR INC | HVQCCN, | unknown | 8542.39.00.01 | QFN | 28 | ||||||||||||||||
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CV210-1
WJ Communications Inc
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Check for Price | No | Transferred | 5.5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N28 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 250 | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 6 mm | 6 mm | 1 mm | WJ COMMUNICATIONS INC | PLASTIC, QFN-28 | unknown | ||||||||||||||
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HFA3661IA
Intersil Corporation
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Check for Price | No | Obsolete | 5.5 V | BIPOLAR | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e0 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 635 µm | DUAL | 3.9 mm | 1.75 mm | INTERSIL CORP | PLASTIC, SSOP-20 | not_compliant | 8542.39.00.01 | |||||||||||||||
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MAX2092ETP+
Maxim Integrated Products
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$17.2714 | Yes | Yes | Transferred | 5.5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | S-XQCC-N20 | e3 | 1 | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | 5 X 5 MM, ROHS COMPLIANT, TQFP-20 | compliant | 8542.39.00.01 | EAR99 | |||||||||||||
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CV211-2
TriQuint Semiconductor
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Check for Price | Transferred | 5.5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | QUAD | 6 mm | 6 mm | 1 mm | TRIQUINT SEMICONDUCTOR INC | HVQCCN, | unknown | 8542.39.00.01 | QFN | 28 | ||||||||||||||||
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MAX2092ETP+
Analog Devices Inc
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Check for Price | Yes | Active | 5.5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | S-XQCC-N20 | e3 | 1 | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | ANALOG DEVICES INC | 5 X 5 MM, ROHS COMPLIANT, TQFP-20 | compliant | 20-LFCSP-5X5X0.75 | 20 | 20-LFCSP-5X5X0.75 | 2012-07-10 | Analog Devices | |||||||||||
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CV211-2
Qorvo
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Check for Price | Active | 5.5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | QUAD | 6 mm | 6 mm | 1 mm | QORVO INC | HVQCCN, | compliant | 8542.39.00.01 | ||||||||||||||||||
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MAX2092ETP+T
Analog Devices Inc
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Check for Price | Yes | Active | 5.5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | S-XQCC-N20 | e3 | 1 | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | ANALOG DEVICES INC | 5 X 5 MM, ROHS COMPLIANT, TQFP-20 | compliant | 20-LFCSP-5X5X0.75 | 20 | 20-LFCSP-5X5X0.75 | 2012-07-10 | ||||||||||||
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CV211-1
WJ Communications Inc
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Check for Price | No | Transferred | 5.5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N28 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 250 | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 6 mm | 6 mm | 1 mm | WJ COMMUNICATIONS INC | PLASTIC, QFN-28 | unknown |