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Parametric results for: Cellular Telephone Circuits

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BB-SR30900020-SWH
 Advantech Co Ltd 		Check for Price Active BASEBAND CIRCUIT 1 X-XXMA-X 75 °C -40 °C XMA UNSPECIFIED MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED ADVANTECH CO LTD unknown
99889-00
 Trimble Navigation Limited 		Check for Price Contact Manufacturer 3.3 V CMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XDMA-N28 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 28 UNSPECIFIED SQUARE MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL TRIMBLE NAVIGATION LTD unknown ,
RF3228SB
 RF Micro Devices Inc 		Check for Price Transferred 3.6 V CMOS RF AND BASEBAND CIRCUIT 1 OTHER R-XBCC-B31 Not Qualified 85 °C -20 °C 31 UNSPECIFIED HBCC RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG YES BUTT BOTTOM 6 mm 7 mm 1.015 mm RF MICRO DEVICES INC unknown HBCC, MODULE 30 8542.39.00.01
RF2483SR
 RF Micro Devices Inc 		Check for Price Transferred 2.7 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N20 Not Qualified 85 °C -40 °C 20 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 4 mm 4 mm 900 µm RF MICRO DEVICES INC unknown HVQCCN, QFN 20 8542.39.00.01 5A991.G
MAX1959ETP+
 Maxim Integrated Products 		Check for Price Yes Yes Transferred 3.6 V BICMOS BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N20 e3 Not Qualified 1 85 °C -40 °C 260 30 20 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 650 µm QUAD 5 mm 5 mm 800 µm MAXIM INTEGRATED PRODUCTS INC compliant HVQCCN, QFN 20 8542.39.00.01
MAX4003EUA
 Maxim Integrated Products 		Check for Price No No Obsolete 3 V CMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-PDSO-G8 e0 Not Qualified 1 85 °C -40 °C 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 3 mm 3 mm 1.1 mm MAXIM INTEGRATED PRODUCTS INC not_compliant MO-187C-AA, MICRO, SOP-8 TSSOP 8 8542.39.00.01 EAR99
UAA3580HN
 NXP Semiconductors 		Check for Price Obsolete 1.8 V BICMOS RF AND BASEBAND CIRCUIT 1 63 µA OTHER S-PQCC-N24 e3/e4 Not Qualified 70 °C -30 °C 24 PLASTIC/EPOXY HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES TIN/NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm NXP SEMICONDUCTORS compliant 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT-616-1, HVQFN-24 QFN 24 8542.39.00.01
RF9802TR7
 RF Micro Devices Inc 		Check for Price Yes Transferred 3.5 V CMOS RF AND BASEBAND CIRCUIT 1 10 nA OTHER R-XBCC-B23 Not Qualified 5A 85 °C -30 °C 23 UNSPECIFIED BCC LCC22,.2X.26,40/36 RECTANGULAR CHIP CARRIER YES BUTT 910 µm BOTTOM 5.24 mm 6.63 mm 1.05 mm RF MICRO DEVICES INC unknown BCC, LCC22,.2X.26,40/36 QMA 22 8542.39.00.01
RF5765SR
 RF Micro Devices Inc 		Check for Price Yes Yes Transferred 3.3 V RF AND BASEBAND CIRCUIT 1 290 µA COMMERCIAL S-XQCC-N16 Not Qualified 2 70 °C -10 °C 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 3 mm 3 mm 500 µm RF MICRO DEVICES INC compliant HVQCCN, LCC16,.12SQ,20 QFN 16 8517.70.00.00 5A991.G
RDA2032ZSR
 RF Micro Devices Inc 		Check for Price Yes Transferred 5 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N32 Not Qualified 3 85 °C -40 °C 32 UNSPECIFIED HQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG YES NO LEAD 500 µm QUAD 5.2 mm 5.2 mm 1.36 mm RF MICRO DEVICES INC unknown HQCCN, MCM 32 8542.33.00.01 5A991.G
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