Parametric results for: Cellular Telephone Circuits

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Select parts from the table below to compare.
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Select Parts Part Number
BALF-NRG-02D3
STMicroelectronics
LTE3401HX
NXP Semiconductors
BGU7258X
NXP Semiconductors
BGC100GN6E6327XTSA1
Infineon Technologies AG
BGA7H1BN6E6327XTSA1
Infineon Technologies AG
BGS14MPA9E6327XTSA1
Infineon Technologies AG
BGA7L1BN6E6327XTSA1
Infineon Technologies AG
MAX2608EUT+T
Maxim Integrated Products
LMV225TLX/NOPB
Texas Instruments
LMV225URX/NOPB
Texas Instruments
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Supply Voltage-Nom Technology Number of Channels Telecom IC Type
Number of Functions Supply Current-Max
Temperature Grade
JESD-30 Code
JESD-609 Code
Qualification Status
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Width
Length
Seated Height-Max
Ihs Manufacturer
Package Description
Reach Compliance Code
Samacsys Manufacturer
HTS Code
Date Of Intro
Part Package Code
Pin Count
Manufacturer Package Code
ECCN Code
Yes Active RF AND BASEBAND CIRCUIT 1 R-PBGA-B4 e1 105 °C -40 °C 260 30 4 PLASTIC/EPOXY VBGA BGA4,2X2,40/16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 855 µm 1.385 mm 690 µm STMICROELECTRONICS CSPG-4 compliant STMicroelectronics
Yes End Of Life 1.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-B6 1 85 °C -40 °C 260 6 PLASTIC/EPOXY BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm NXP SEMICONDUCTORS XSON-6 compliant NXP 8542.33.00.01 2018-10-26
Yes End Of Life 3.3 V RF AND BASEBAND CIRCUIT 1 S-PDSO-N6 e4 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.06,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 1.6 mm 1.6 mm 500 µm NXP SEMICONDUCTORS XSON-6 compliant NXP 8542.33.00.01 DFN 6 SOT1189-1
Yes Active CMOS RF AND BASEBAND CIRCUIT 1 R-XBCC-B6 1 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT BOTTOM INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
Yes Obsolete RF AND BASEBAND CIRCUIT 1 INFINEON TECHNOLOGIES AG compliant Infineon 8542.39.00.01
Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
Yes Yes Transferred 2.75 V BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G6 e3 Not Qualified 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.625 mm 2.9 mm 1.45 mm MAXIM INTEGRATED PRODUCTS INC ULTRA SMALL, SOT-23, 6 PIN compliant 8542.39.00.01 SOT-23 6 EAR99
Yes Yes Active 2.7 V 1 RF AND BASEBAND CIRCUIT 1 8 mA INDUSTRIAL S-PBGA-B4 e1 Not Qualified 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.014 mm 1.014 mm 675 µm TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 DSBGA 4 EAR99
Yes Yes Active 5 V 1 RF AND BASEBAND CIRCUIT 1 8 mA S-XBGA-B4 e1 1 260 30 4 UNSPECIFIED VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL BOTTOM TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 EAR99
Compare
BALF-NRG-02D3
STMicroelectronics
$0.0739 Buy Yes Active RF AND BASEBAND CIRCUIT 1 R-PBGA-B4 e1 105 °C -40 °C 260 30 4 PLASTIC/EPOXY VBGA BGA4,2X2,40/16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 855 µm 1.385 mm 690 µm STMICROELECTRONICS CSPG-4 compliant STMicroelectronics
LTE3401HX
NXP Semiconductors
$0.2619 Buy Yes End Of Life 1.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-B6 1 85 °C -40 °C 260 6 PLASTIC/EPOXY BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm NXP SEMICONDUCTORS XSON-6 compliant NXP 8542.33.00.01 2018-10-26
BGU7258X
NXP Semiconductors
$0.3597 Buy Yes End Of Life 3.3 V RF AND BASEBAND CIRCUIT 1 S-PDSO-N6 e4 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.06,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 1.6 mm 1.6 mm 500 µm NXP SEMICONDUCTORS XSON-6 compliant NXP 8542.33.00.01 DFN 6 SOT1189-1
BGC100GN6E6327XTSA1
Infineon Technologies AG
$0.3745 Buy Yes Active CMOS RF AND BASEBAND CIRCUIT 1 R-XBCC-B6 1 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT BOTTOM INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
BGA7H1BN6E6327XTSA1
Infineon Technologies AG
$0.3796 Buy Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
BGS14MPA9E6327XTSA1
Infineon Technologies AG
$0.4030 Buy Yes Obsolete RF AND BASEBAND CIRCUIT 1 INFINEON TECHNOLOGIES AG compliant Infineon 8542.39.00.01
BGA7L1BN6E6327XTSA1
Infineon Technologies AG
$0.4496 Buy Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant Infineon 8542.39.00.01
MAX2608EUT+T
Maxim Integrated Products
$0.4748 Buy Yes Yes Transferred 2.75 V BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G6 e3 Not Qualified 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.625 mm 2.9 mm 1.45 mm MAXIM INTEGRATED PRODUCTS INC ULTRA SMALL, SOT-23, 6 PIN compliant 8542.39.00.01 SOT-23 6 EAR99
LMV225TLX/NOPB
Texas Instruments
$0.5564 Buy Yes Yes Active 2.7 V 1 RF AND BASEBAND CIRCUIT 1 8 mA INDUSTRIAL S-PBGA-B4 e1 Not Qualified 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.014 mm 1.014 mm 675 µm TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 DSBGA 4 EAR99
LMV225URX/NOPB
Texas Instruments
$0.5564 Buy Yes Yes Active 5 V 1 RF AND BASEBAND CIRCUIT 1 8 mA S-XBGA-B4 e1 1 260 30 4 UNSPECIFIED VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL BOTTOM TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 EAR99