Filter Your Search
1 - 10 of 5,002 results
Select Parts | Part Number |
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BALF-NRG-02D3
STMicroelectronics
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LTE3401HX
NXP Semiconductors
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BGU7258X
NXP Semiconductors
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BGC100GN6E6327XTSA1
Infineon Technologies AG
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BGA7H1BN6E6327XTSA1
Infineon Technologies AG
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BGS14MPA9E6327XTSA1
Infineon Technologies AG
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BGA7L1BN6E6327XTSA1
Infineon Technologies AG
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MAX2608EUT+T
Maxim Integrated Products
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LMV225TLX/NOPB
Texas Instruments
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LMV225URX/NOPB
Texas Instruments
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom | Technology | Number of Channels |
Telecom IC Type
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Number of Functions |
Supply Current-Max
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Temperature Grade
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JESD-30 Code
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JESD-609 Code
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Qualification Status
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Pitch
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Terminal Position
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Width
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Length
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Seated Height-Max
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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Samacsys Manufacturer
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HTS Code
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Date Of Intro
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Part Package Code
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Pin Count
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Manufacturer Package Code
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ECCN Code
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Yes | Active | RF AND BASEBAND CIRCUIT | 1 | R-PBGA-B4 | e1 | 105 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VBGA | BGA4,2X2,40/16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 855 µm | 1.385 mm | 690 µm | STMICROELECTRONICS | CSPG-4 | compliant | STMicroelectronics | |||||||||||||||
Yes | End Of Life | 1.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | NXP SEMICONDUCTORS | XSON-6 | compliant | NXP | 8542.33.00.01 | 2018-10-26 | ||||||||||||||
Yes | End Of Life | 3.3 V | RF AND BASEBAND CIRCUIT | 1 | S-PDSO-N6 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.06,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 1.6 mm | 1.6 mm | 500 µm | NXP SEMICONDUCTORS | XSON-6 | compliant | NXP | 8542.33.00.01 | DFN | 6 | SOT1189-1 | |||||||||
Yes | Active | CMOS | RF AND BASEBAND CIRCUIT | 1 | R-XBCC-B6 | 1 | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | BOTTOM | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | |||||||||||||||||||||||
Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | ||||||||||||||
Yes | Obsolete | RF AND BASEBAND CIRCUIT | 1 | INFINEON TECHNOLOGIES AG | compliant | Infineon | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||
Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | ||||||||||||||
Yes | Yes | Transferred | 2.75 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.625 mm | 2.9 mm | 1.45 mm | MAXIM INTEGRATED PRODUCTS INC | ULTRA SMALL, SOT-23, 6 PIN | compliant | 8542.39.00.01 | SOT-23 | 6 | EAR99 | ||||||||
Yes | Yes | Active | 2.7 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | S-PBGA-B4 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.014 mm | 1.014 mm | 675 µm | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | 8542.39.00.01 | DSBGA | 4 | EAR99 | ||||||
Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | S-XBGA-B4 | e1 | 1 | 260 | 30 | 4 | UNSPECIFIED | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | 8542.39.00.01 | EAR99 |
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BALF-NRG-02D3
STMicroelectronics
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$0.0739 Buy | Yes | Active | RF AND BASEBAND CIRCUIT | 1 | R-PBGA-B4 | e1 | 105 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VBGA | BGA4,2X2,40/16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 855 µm | 1.385 mm | 690 µm | STMICROELECTRONICS | CSPG-4 | compliant | STMicroelectronics | ||||||||||||||||
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LTE3401HX
NXP Semiconductors
|
$0.2619 Buy | Yes | End Of Life | 1.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | NXP SEMICONDUCTORS | XSON-6 | compliant | NXP | 8542.33.00.01 | 2018-10-26 | |||||||||||||||
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BGU7258X
NXP Semiconductors
|
$0.3597 Buy | Yes | End Of Life | 3.3 V | RF AND BASEBAND CIRCUIT | 1 | S-PDSO-N6 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.06,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 1.6 mm | 1.6 mm | 500 µm | NXP SEMICONDUCTORS | XSON-6 | compliant | NXP | 8542.33.00.01 | DFN | 6 | SOT1189-1 | ||||||||||
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BGC100GN6E6327XTSA1
Infineon Technologies AG
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$0.3745 Buy | Yes | Active | CMOS | RF AND BASEBAND CIRCUIT | 1 | R-XBCC-B6 | 1 | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | BOTTOM | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | ||||||||||||||||||||||||
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BGA7H1BN6E6327XTSA1
Infineon Technologies AG
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$0.3796 Buy | Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | |||||||||||||||
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BGS14MPA9E6327XTSA1
Infineon Technologies AG
|
$0.4030 Buy | Yes | Obsolete | RF AND BASEBAND CIRCUIT | 1 | INFINEON TECHNOLOGIES AG | compliant | Infineon | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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BGA7L1BN6E6327XTSA1
Infineon Technologies AG
|
$0.4496 Buy | Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | Infineon | 8542.39.00.01 | |||||||||||||||
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MAX2608EUT+T
Maxim Integrated Products
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$0.4748 Buy | Yes | Yes | Transferred | 2.75 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.625 mm | 2.9 mm | 1.45 mm | MAXIM INTEGRATED PRODUCTS INC | ULTRA SMALL, SOT-23, 6 PIN | compliant | 8542.39.00.01 | SOT-23 | 6 | EAR99 | |||||||||
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LMV225TLX/NOPB
Texas Instruments
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$0.5564 Buy | Yes | Yes | Active | 2.7 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | S-PBGA-B4 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.014 mm | 1.014 mm | 675 µm | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | 8542.39.00.01 | DSBGA | 4 | EAR99 | |||||||
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LMV225URX/NOPB
Texas Instruments
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$0.5564 Buy | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | S-XBGA-B4 | e1 | 1 | 260 | 30 | 4 | UNSPECIFIED | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | 8542.39.00.01 | EAR99 |