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RF2483SR
RF Micro Devices Inc
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Check for Price | Transferred | 2.7 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | Not Qualified | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 900 µm | RF MICRO DEVICES INC | QFN | HVQCCN, | 20 | unknown | 5A991.G | 8542.39.00.01 | |||||||||||
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MAX1959ETP+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.6 V | BICMOS | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 20 | compliant | 8542.39.00.01 | |||||
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UAA3580HN
NXP Semiconductors
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Check for Price | Obsolete | 1.8 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | 63 µA | OTHER | S-PQCC-N24 | e3/e4 | Not Qualified | 70 °C | -30 °C | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN/NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | NXP SEMICONDUCTORS | QFN | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT-616-1, HVQFN-24 | 24 | compliant | 8542.39.00.01 | ||||||||
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ADL5363XCPZ-R7
Analog Devices Inc
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Check for Price | Yes | Yes | Obsolete | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e3 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 900 µm | ANALOG DEVICES INC | QFN | 5 X 5 MM, ROHS COMPLIANT, MO-220VHHC, LFCSP-20 | 20 | unknown | 8542.39.00.01 | |||||||||
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MAX2531ETI
Rochester Electronics LLC
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Check for Price | Yes | Active | 2.75 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N28 | e0 | COMMERCIAL | 1 | 85 °C | -40 °C | 240 | 20 | 28 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 900 µm | ROCHESTER ELECTRONICS LLC | QFN | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | 28 | unknown | |||||||
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MRFIC1854AR2
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 2.7 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e0 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.2 mm | MOTOROLA INC | TSSOP, | unknown | 8542.39.00.01 | |||||||||||
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HMC687LP4
Hittite Microwave Corp
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Check for Price | No | No | Transferred | 5 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 235 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | HITTITE MICROWAVE CORP | QFN | HVQCCN, | 24 | compliant | EAR99 | 8542.39.00.01 | |||||
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RF2861TR7
RF Micro Devices Inc
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Check for Price | Yes | Transferred | 2.75 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | RF MICRO DEVICES INC | HVQCCN, | unknown | 5A991.G | 8517.62.00.50 | |||||||||||||
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MC13760
Motorola Semiconductor Products
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Check for Price | Obsolete | 2.775 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B104 | Not Qualified | 85 °C | -40 °C | 104 | PLASTIC/EPOXY | LFBGA | BGA104,11X11,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | 1.6 mm | MOTOROLA INC | LFBGA, BGA104,11X11,32 | unknown | 8542.39.00.01 | |||||||||||||
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MRFIC1854R2
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 2.7 V | BICMOS | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e0 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.2 mm | MOTOROLA INC | TSSOP, | unknown | 8542.39.00.01 |