Parametric results for: Other Memory ICs

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Sorted By: Number of Functions
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3DMR1M08VS1426IBH-00
3D PLUS
Check for Price Contact Manufacturer 1.0486 Mbit 8 128KX8 3.3 V MEMORY CIRCUIT 1 128000 131.072 k ASYNCHRONOUS 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G44 85 °C -40 °C 44 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 800 µm DUAL 4.1 mm 20 mm 10.95 mm 3D PLUS SA SSOP, unknown EAR99 8542.32.00.71
DS2405T
Dallas Semiconductor
Check for Price Transferred 64 bit 1 64X1 MEMORY CIRCUIT 1 64 64 words ASYNCHRONOUS 6 V 2.8 V CMOS INDUSTRIAL O-PBCY-T3 Not Qualified 85 °C -40 °C 3 PLASTIC/EPOXY ROUND CYLINDRICAL NO THROUGH-HOLE BOTTOM DALLAS SEMICONDUCTOR TO-92, 3 PIN unknown EAR99 8542.32.00.71
S29DS032J66FFI003
Spansion
Check for Price Obsolete 33.5544 Mbit 1 32MX1 1.8 V MEMORY CIRCUIT 1 32000000 33.5544 M SYNCHRONOUS 1.95 V 1.65 V CMOS INDUSTRIAL R-PBGA-B80 85 °C -40 °C 80 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL BOTTOM SPANSION INC BGA, unknown EAR99 8542.32.00.71 BGA 80
LRS1830
Sharp Corp
Check for Price Obsolete 134.2177 Mbit 16 8MX16 3 V MEMORY CIRCUIT SCRAM IS ORGANISED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH 1 8000000 8.3886 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B115 Not Qualified 85 °C -30 °C 115 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 14 mm 9 mm SHARP CORP 9 X 14 MM, PLASTIC, CSP-115 unknown EAR99 8542.32.00.71
MB84VD21181A-85-PBS
FUJITSU Semiconductor Limited
Check for Price No Transferred 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT 512K X 8 SRAM ALSO AVAILABLE 1 1000000 1.0486 M ASYNCHRONOUS 3.6 V 2.7 V CMOS OTHER R-PBGA-B69 Not Qualified 85 °C -25 °C 69 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 11 mm 8 mm FUJITSU SEMICONDUCTOR AMERICA INC LFBGA, unknown EAR99 8542.32.00.71 BGA 69
S71WS512PC0HF3HR3
Spansion
Check for Price Yes Obsolete 536.8709 Mbit 16 32MX16 1.8 V MEMORY CIRCUIT SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE 1 32000000 33.5544 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e1 3 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 11.6 mm 8 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 84
MSM51V8222A-30GS-K
LAPIS Semiconductor Co Ltd
Check for Price Obsolete 2.0972 Mbit 8 256KX8 3.3 V MEMORY CIRCUIT 1 256000 262.144 k SYNCHRONOUS 3 mA 35 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified 70 °C 28 PLASTIC/EPOXY SOP SOP28,.45 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.5 mm 18.5 mm 8.8 mm LAPIS SEMICONDUCTOR CO LTD SOP, SOP28,.45 unknown EAR99 8542.32.00.71 SOIC 28
FM1208-100SC
Ramtron International Corporation
Check for Price No Obsolete 4.096 kbit 8 512X8 5 V 100 ns FRAM 10 10000000000 Write/Erase Cycles 1 512 512 words ASYNCHRONOUS PARALLEL 10 µA 4.5 V 16 µA 5.5 V 4.5 V CMOS R-PDSO-G24 70 °C 240 24 PLASTIC/EPOXY SOP SOP24,.5 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.3 mm 16.51 mm 8.4 mm RAMTRON INTERNATIONAL CORP SOP, SOP24,.4 unknown EAR99 8542.32.00.71
S71WS512NC0BFIAF2
Spansion
Check for Price Yes Obsolete 536.8709 Mbit 16 32MX16 1.8 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE 1 32000000 33.5544 M ASYNCHRONOUS 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B84 Not Qualified e1 3 85 °C -40 °C 84 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 11.6 mm 8 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 84
S71GL032NA0BFW0Z3
Spansion
Check for Price Yes Yes Transferred 33.5544 Mbit 16 2MX16 3 V 90 ns MEMORY CIRCUIT PSRAM IS ORGANIZED AS 1M X 16 FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified e1 3 85 °C -25 °C 260 40 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 unknown EAR99 8542.32.00.71 BGA 56