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3DMR1M08VS1426IBH-00
3D PLUS
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Check for Price | Contact Manufacturer | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | MEMORY CIRCUIT | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 800 µm | DUAL | 4.1 mm | 20 mm | 10.95 mm | 3D PLUS SA | SSOP, | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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DS2405T
Dallas Semiconductor
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Check for Price | Transferred | 64 bit | 1 | 64X1 | MEMORY CIRCUIT | 1 | 64 | 64 words | ASYNCHRONOUS | 6 V | 2.8 V | CMOS | INDUSTRIAL | O-PBCY-T3 | Not Qualified | 85 °C | -40 °C | 3 | PLASTIC/EPOXY | ROUND | CYLINDRICAL | NO | THROUGH-HOLE | BOTTOM | DALLAS SEMICONDUCTOR | TO-92, 3 PIN | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||||||||||
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S29DS032J66FFI003
Spansion
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Check for Price | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 1.8 V | MEMORY CIRCUIT | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | R-PBGA-B80 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | BOTTOM | SPANSION INC | BGA, | unknown | EAR99 | 8542.32.00.71 | BGA | 80 | ||||||||||||||||||||||||
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LRS1830
Sharp Corp
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Check for Price | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3 V | MEMORY CIRCUIT | SCRAM IS ORGANISED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B115 | Not Qualified | 85 °C | -30 °C | 115 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 9 mm | SHARP CORP | 9 X 14 MM, PLASTIC, CSP-115 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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MB84VD21181A-85-PBS
FUJITSU Semiconductor Limited
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Check for Price | No | Transferred | 16.7772 Mbit | 16 | 1MX16 | 3 V | MEMORY CIRCUIT | 512K X 8 SRAM ALSO AVAILABLE | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3.6 V | 2.7 V | CMOS | OTHER | R-PBGA-B69 | Not Qualified | 85 °C | -25 °C | 69 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.4 mm | 11 mm | 8 mm | FUJITSU SEMICONDUCTOR AMERICA INC | LFBGA, | unknown | EAR99 | 8542.32.00.71 | BGA | 69 | |||||||||||||||||
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S71WS512PC0HF3HR3
Spansion
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Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | MEMORY CIRCUIT | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.6 mm | 8 mm | SPANSION INC | TFBGA, | compliant | EAR99 | 8542.32.00.71 | BGA | 84 | ||||||||||||||
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MSM51V8222A-30GS-K
LAPIS Semiconductor Co Ltd
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Check for Price | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 3.3 V | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3 mA | 35 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.45 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.5 mm | 18.5 mm | 8.8 mm | LAPIS SEMICONDUCTOR CO LTD | SOP, SOP28,.45 | unknown | EAR99 | 8542.32.00.71 | SOIC | 28 | |||||||||||||||||
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FM1208-100SC
Ramtron International Corporation
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Check for Price | No | Obsolete | 4.096 kbit | 8 | 512X8 | 5 V | 100 ns | FRAM | 10 | 10000000000 Write/Erase Cycles | 1 | 512 | 512 words | ASYNCHRONOUS | PARALLEL | 10 µA | 4.5 V | 16 µA | 5.5 V | 4.5 V | CMOS | R-PDSO-G24 | 70 °C | 240 | 24 | PLASTIC/EPOXY | SOP | SOP24,.5 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.3 mm | 16.51 mm | 8.4 mm | RAMTRON INTERNATIONAL CORP | SOP, SOP24,.4 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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S71WS512NC0BFIAF2
Spansion
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Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.6 mm | 8 mm | SPANSION INC | TFBGA, | compliant | EAR99 | 8542.32.00.71 | BGA | 84 | ||||||||||||||
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S71GL032NA0BFW0Z3
Spansion
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Check for Price | Yes | Yes | Transferred | 33.5544 Mbit | 16 | 2MX16 | 3 V | 90 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 1M X 16 | FLASH+SRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | unknown | EAR99 | 8542.32.00.71 | BGA | 56 |