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31 - 40 of 57,093 results
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MB84SD23280FA-70PBS-E1
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | MEMORY CIRCUIT | SRAM IS ORGANIZED AS 512K X 16 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 1.95 V | 1.65 V | CMOS | OTHER | R-PBGA-B73 | Not Qualified | e1 | 85 °C | -30 °C | 73 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.34 mm | 11.6 mm | 8 mm | SPANSION INC | BGA | LFBGA, | 73 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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S71NS256NB0BJWVN1
Cypress Semiconductor
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e2 | 3 | 85 °C | -25 °C | 260 | 40 | 60 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | CYPRESS SEMICONDUCTOR CORP | 10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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MB84VD21081EA-85-PTS
FUJITSU Limited
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Check for Price | No | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | MEMORY CIRCUIT | 128K X 16 SRAM ALSO AVAILABLE | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | PLASTIC/EPOXY | TSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 400 µm | DUAL | 1.2 mm | 12.4 mm | 12 mm | FUJITSU LTD | TSOP, | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||
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S75WS256NDFBAWLK2
Spansion
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Check for Price | No | Obsolete | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | SRAM ORGANISED AS 128 MB (8M X 16-BIT) | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e0 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.4 mm | 9 mm | 12 mm | SPANSION INC | BGA | LFBGA, | 84 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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S71JL128HC0BFW022
AMD
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Check for Price | Yes | Transferred | 67.1089 Mbit | 16 | 4MX16 | 3 V | 85 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 64M BIT FLASH | FLASH+PSRAM | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 45 µA | 3.3 V | 2.7 V | CMOS | OTHER | R-PBGA-B88 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 88 | PLASTIC/EPOXY | LFBGA | BGA88,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 11.6 mm | 8 mm | ADVANCED MICRO DEVICES INC | BGA | LFBGA, BGA88,10X12,32 | 88 | compliant | EAR99 | 8542.32.00.71 | |||||||
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S71JL128HB0BAI00
AMD
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Check for Price | Yes | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3 V | 55 ns | MEMORY CIRCUIT | SRAM IS ORGANISED AS 2KX16 | FLASH+PSRAM | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B73 | Not Qualified | 85 °C | -40 °C | 73 | PLASTIC/EPOXY | LFBGA | BGA73,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.4 mm | 11.6 mm | 8 mm | ADVANCED MICRO DEVICES INC | LFBGA, BGA73,10X12,32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||
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IC71V08F32ES08-85B
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 85 ns | MEMORY CIRCUIT | FLASH+SRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 45 µA | 3.3 V | 2.7 V | CMOS | OTHER | R-PBGA-B64 | Not Qualified | e0 | 85 °C | -25 °C | 64 | PLASTIC/EPOXY | FBGA | BGA64,8X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.4 mm | 12 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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THGBMGG9U4LBAIR
Toshiba America Electronic Components
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Check for Price | Obsolete | 549.7558 Gbit | 8 | 64GX8 | MEMORY CIRCUIT | 1 | 64000000000 | 68.7195 G | CMOS | OTHER | R-PBGA-B153 | 85 °C | -25 °C | 153 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | BOTTOM | TOSHIBA CORP | FBGA-153 | unknown | EAR99 | 8542.32.00.71 | 2017-01-11 | ||||||||||||||||||||||||||
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S70KS1281DGBHV033
Cypress Semiconductor
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Check for Price | Transferred | 134.2177 Mbit | 8 | 16MX8 | 1.8 V | MEMORY CIRCUIT | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B24 | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | VBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-24 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||||||
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WEDPNF8M721V-1215BC
Microsemi Corporation
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Check for Price | No | No | Obsolete | 603.9798 Mbit | 72 | 8MX72 | 3.3 V | MEMORY CIRCUIT | FLASH IS ORGANIZED AS 1M X 8/512K X 16 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PBGA-B275 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 275 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 2.2 mm | 32 mm | 25 mm | MICROSEMI CORP | BGA | BGA, | 275 | compliant | EAR99 | 8542.32.00.71 |