Parametric results for: Other Memory ICs

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MB84SD23280FA-70PBS-E1
Spansion
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 1.8 V MEMORY CIRCUIT SRAM IS ORGANIZED AS 512K X 16 1 4000000 4.1943 M ASYNCHRONOUS 1.95 V 1.65 V CMOS OTHER R-PBGA-B73 Not Qualified e1 85 °C -30 °C 73 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.34 mm 11.6 mm 8 mm SPANSION INC BGA LFBGA, 73 compliant EAR99 8542.32.00.71
S71NS256NB0BJWVN1
Cypress Semiconductor
Check for Price Yes Transferred 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT 1 16000000 16.7772 M SYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B60 Not Qualified e2 3 85 °C -25 °C 260 40 60 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 500 µm BOTTOM 1.2 mm 11 mm 10 mm CYPRESS SEMICONDUCTOR CORP 10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 compliant EAR99 8542.32.00.71
MB84VD21081EA-85-PTS
FUJITSU Limited
Check for Price No Active 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT 128K X 16 SRAM ALSO AVAILABLE 1 1000000 1.0486 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PDSO-G56 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 56 PLASTIC/EPOXY TSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 400 µm DUAL 1.2 mm 12.4 mm 12 mm FUJITSU LTD TSOP, compliant EAR99 8542.32.00.71
S75WS256NDFBAWLK2
Spansion
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT SRAM ORGANISED AS 128 MB (8M X 16-BIT) 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e0 85 °C -25 °C 84 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 9 mm 12 mm SPANSION INC BGA LFBGA, 84 compliant EAR99 8542.32.00.71
S71JL128HC0BFW022
AMD
Check for Price Yes Transferred 67.1089 Mbit 16 4MX16 3 V 85 ns MEMORY CIRCUIT PSRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 64M BIT FLASH FLASH+PSRAM 1 4000000 4.1943 M ASYNCHRONOUS 45 µA 3.3 V 2.7 V CMOS OTHER R-PBGA-B88 Not Qualified e1 3 85 °C -25 °C 88 PLASTIC/EPOXY LFBGA BGA88,10X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 11.6 mm 8 mm ADVANCED MICRO DEVICES INC BGA LFBGA, BGA88,10X12,32 88 compliant EAR99 8542.32.00.71
S71JL128HB0BAI00
AMD
Check for Price Yes Obsolete 134.2177 Mbit 16 8MX16 3 V 55 ns MEMORY CIRCUIT SRAM IS ORGANISED AS 2KX16 FLASH+PSRAM 1 8000000 8.3886 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B73 Not Qualified 85 °C -40 °C 73 PLASTIC/EPOXY LFBGA BGA73,10X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.4 mm 11.6 mm 8 mm ADVANCED MICRO DEVICES INC LFBGA, BGA73,10X12,32 compliant EAR99 8542.32.00.71
IC71V08F32ES08-85B
Integrated Silicon Solution Inc
Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3 V 85 ns MEMORY CIRCUIT FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 5 µA 45 µA 3.3 V 2.7 V CMOS OTHER R-PBGA-B64 Not Qualified e0 85 °C -25 °C 64 PLASTIC/EPOXY FBGA BGA64,8X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.4 mm 12 mm 8 mm INTEGRATED SILICON SOLUTION INC compliant EAR99 8542.32.00.71
THGBMGG9U4LBAIR
Toshiba America Electronic Components
Check for Price Obsolete 549.7558 Gbit 8 64GX8 MEMORY CIRCUIT 1 64000000000 68.7195 G CMOS OTHER R-PBGA-B153 85 °C -25 °C 153 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL BOTTOM TOSHIBA CORP FBGA-153 unknown EAR99 8542.32.00.71 2017-01-11
S70KS1281DGBHV033
Cypress Semiconductor
Check for Price Transferred 134.2177 Mbit 8 16MX8 1.8 V MEMORY CIRCUIT 1 16000000 16.7772 M SYNCHRONOUS 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B24 105 °C -40 °C 24 PLASTIC/EPOXY VBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE YES BALL 1 mm BOTTOM 1 mm 8 mm 6 mm CYPRESS SEMICONDUCTOR CORP FBGA-24 compliant EAR99 8542.32.00.71
WEDPNF8M721V-1215BC
Microsemi Corporation
Check for Price No No Obsolete 603.9798 Mbit 72 8MX72 3.3 V MEMORY CIRCUIT FLASH IS ORGANIZED AS 1M X 8/512K X 16 1 8000000 8.3886 M SYNCHRONOUS 3.6 V 3 V CMOS COMMERCIAL R-PBGA-B275 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 275 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.2 mm 32 mm 25 mm MICROSEMI CORP BGA BGA, 275 compliant EAR99 8542.32.00.71