Parametric results for: Other Memory ICs

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LF3304QC18
LOGIC Devices Inc
Check for Price No Obsolete 49.152 kbit 12 4KX12 3.3 V MEMORY CIRCUIT 2 4000 4.096 k SYNCHRONOUS CMOS COMMERCIAL R-PQFP-G100 Not Qualified 3 70 °C 225 100 PLASTIC/EPOXY QFP RECTANGULAR FLATPACK YES GULL WING 650 µm QUAD 3.1496 mm 20 mm 14 mm LOGIC DEVICES INC QFP QFP, 100 unknown EAR99 8542.32.00.71
LF3304QC25
LOGIC Devices Inc
Check for Price No Obsolete 49.152 kbit 12 4KX12 3.3 V MEMORY CIRCUIT 2 4000 4.096 k SYNCHRONOUS CMOS COMMERCIAL R-PQFP-G100 Not Qualified 3 70 °C 225 100 PLASTIC/EPOXY QFP RECTANGULAR FLATPACK YES GULL WING 650 µm QUAD 3.1496 mm 20 mm 14 mm LOGIC DEVICES INC QFP QFP, 100 unknown EAR99 8542.32.00.71
S75NS128NDEZFWNK2
Spansion
Check for Price Yes Obsolete 134.2177 Mbit 16 8MX16 1.8 V MEMORY CIRCUIT 1 8000000 8.3886 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B133 Not Qualified e1 85 °C -25 °C 260 40 133 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.3 mm 11 mm 10 mm SPANSION INC BGA LFBGA, 133 compliant EAR99 8542.32.00.71
M36W0T7040T0ZAQE
STMicroelectronics
Check for Price Yes Transferred 134.2177 Mbit 16 8MX16 70 ns MEMORY CIRCUIT PSRAM IS ORGANIZED AS 1M X 16 FLASH+PSRAM 1 8000000 8.3886 M ASYNCHRONOUS 2 V 1.7 V CMOS OTHER R-PBGA-B88 Not Qualified e1 85 °C -30 °C 88 PLASTIC/EPOXY TFBGA BGA88,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 10 mm 8 mm STMICROELECTRONICS BGA 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 88 unknown EAR99 8542.32.00.71
MT28C128564W18DBW-F706P85TBWT
Micron Technology Inc
Check for Price Obsolete 67.1089 Mbit 16 4MX16 MEMORY CIRCUIT CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH 1 4000000 4.1943 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B77 Not Qualified e1 85 °C -25 °C 77 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 10 mm 8 mm MICRON TECHNOLOGY INC BGA LFBGA, 77 unknown EAR99 8542.32.00.71
SST34HF1622S-70-4C-L1PE
Silicon Storage Technology
Check for Price Yes Transferred 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 1 1000000 1.0486 M ASYNCHRONOUS 3.3 V 2.7 V CMOS COMMERCIAL R-PBGA-B56 Not Qualified e1 70 °C 260 40 56 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.4 mm 10 mm 8 mm SILICON STORAGE TECHNOLOGY INC BGA LFBGA, 56 unknown EAR99 8542.32.00.71
WSE128K16-42G2TC
White Electronic Designs Corp
Check for Price No Transferred 2.0972 Mbit 16 128KX16 5 V 120 ns MEMORY CIRCUIT ALSO CONTAINS 128K X 16 BIT SRAM FLASH+SRAM 1 128000 131.072 k ASYNCHRONOUS 31.2 mA 360 µA 5.5 V 4.5 V CMOS COMMERCIAL S-CQMA-G68 Not Qualified e4 70 °C 68 CERAMIC, METAL-SEALED COFIRED QFP QFP68,.99SQ,50 SQUARE MICROELECTRONIC ASSEMBLY YES GOLD GULL WING 1.27 mm QUAD WHITE ELECTRONIC DESIGNS CORP CERAMIC, QFP-68 unknown EAR99 8542.32.00.71
TH50VSF4683AASB
Toshiba America Electronic Components
Check for Price Transferred 67.1089 Mbit 16 4MX16 3 V 80 ns MEMORY CIRCUIT USER CONFIGURABLE AS 8M X 8 FLASH AND CO... more FLASH+SRAM 1 4000000 4.1943 M ASYNCHRONOUS 50 µA 3.1 V 2.7 V CMOS OTHER R-PBGA-B69 Not Qualified e0 85 °C -30 °C 69 PLASTIC/EPOXY LFBGA BGA69,10X12,32 RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 12 mm 10 mm TOSHIBA CORP BGA LFBGA, BGA69,10X12,32 69 unknown EAR99 8542.32.00.71
AM49LV6408MT10IT
Spansion
Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK 1 4000000 4.1943 M ASYNCHRONOUS 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B69 Not Qualified e0 85 °C -40 °C 69 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 10 mm 8 mm SPANSION INC BGA TFBGA, 69 compliant EAR99 8542.32.00.71
MT28C128532W18DFW-F705P85KBBWT
Micron Technology Inc
Check for Price Obsolete 67.1089 Mbit 16 4MX16 MEMORY CIRCUIT CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH 1 4000000 4.1943 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B77 Not Qualified e1 85 °C -25 °C 77 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 10 mm 8 mm MICRON TECHNOLOGY INC BGA LFBGA, 77 unknown EAR99 8542.32.00.71