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1 - 10 of 10,088 results
Select Parts | Part Number |
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MR27V6441L-XXXMPZ03A
OKI Electric Industry Co Ltd
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HN62314BP-17
Hitachi Ltd
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HN62434P-20
Hitachi Ltd
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DM74L187AW/A+
National Semiconductor Corporation
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UT6764-70PBR
Cobham Advanced Electronic Solutions
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HN62414TT-17
Hitachi Ltd
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MSM531021BRS
LAPIS Semiconductor Co Ltd
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MV23SC16-DG
Dynex Semiconductor
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MR27V852E-XXXJA
LAPIS Semiconductor Co Ltd
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K3P6V1000B-GC15
Samsung Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Clock Frequency-Max (fCLK) |
Memory IC Type
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Additional Feature
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Alternate Memory Width
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Number of Functions | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Parallel/Serial
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Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Operating Temperature-Max
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Transferred | 67.1089 Mbit | 1 | 64MX1 | 3.3 V | 33 MHz | MASK ROM | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G16 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | OKI ELECTRIC INDUSTRY CO LTD | SOIC | SOP, | 16 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
No | Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 170 ns | MASK ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 30 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 41.9 mm | 15.24 mm | HITACHI LTD | DIP | DIP, DIP32,.6 | 32 | unknown | EAR99 | 8542.32.00.71 | ||||||||
Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.8 mm | 15.24 mm | HITACHI LTD | DIP | DIP, | 40 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||
No | Obsolete | 1.024 kbit | 4 | 256X4 | 5 V | 150 ns | MASK ROM | 1 | 256 | 256 words | ASYNCHRONOUS | PARALLEL | 25 µA | TTL | COMMERCIAL | R-XDFP-F16 | e0 | 70 °C | 16 | CERAMIC | DFP | FL16,.3 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DFP, FL16,.3 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||
No | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | MASK ROM | 8000 | 8.192 k | 3 mA | 150 µA | CMOS | R-XDIP-T28 | Not Qualified | e0 | 38535Q/M;38534H;883B | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | AEROFLEX MICROELECTRONIC SOLUTIONS | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||||
Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 170 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | HITACHI LTD | TSOP2 | TSOP2, | 44 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
No | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 100 ns | MASK ROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 50 µA | 30 µA | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP32,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||
No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 450 ns | MASK ROM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 100 µA | CMOS | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GEC PLESSEY SEMICONDUCTORS | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||
No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 100 ns | MASK ROM | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 50 µA | 80 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-J42 | Not Qualified | e0 | 70 °C | 42 | PLASTIC/EPOXY | SOJ | SOJ42,.44 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | J BEND | 1.27 mm | DUAL | 3.75 mm | 27.3 mm | 10.16 mm | LAPIS SEMICONDUCTOR CO LTD | SOJ | SOJ, SOJ42,.44 | 42 | unknown | EAR99 | 8542.32.00.71 | |||||||
No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3.3 V | 150 ns | MASK ROM | ALSO CONFIGURABLE AS 2M X 16 | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 30 µA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | 225 | 30 | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.5 mm | 12.6 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP44,.63 | 44 | compliant | EAR99 | 8542.32.00.71 |
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MR27V6441L-XXXMPZ03A
OKI Electric Industry Co Ltd
|
Check for Price Buy | Transferred | 67.1089 Mbit | 1 | 64MX1 | 3.3 V | 33 MHz | MASK ROM | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G16 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | OKI ELECTRIC INDUSTRY CO LTD | SOIC | SOP, | 16 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||
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HN62314BP-17
Hitachi Ltd
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Check for Price Buy | No | Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 170 ns | MASK ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 30 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 41.9 mm | 15.24 mm | HITACHI LTD | DIP | DIP, DIP32,.6 | 32 | unknown | EAR99 | 8542.32.00.71 | |||||||||
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HN62434P-20
Hitachi Ltd
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Check for Price Buy | Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.8 mm | 15.24 mm | HITACHI LTD | DIP | DIP, | 40 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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DM74L187AW/A+
National Semiconductor Corporation
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Check for Price Buy | No | Obsolete | 1.024 kbit | 4 | 256X4 | 5 V | 150 ns | MASK ROM | 1 | 256 | 256 words | ASYNCHRONOUS | PARALLEL | 25 µA | TTL | COMMERCIAL | R-XDFP-F16 | e0 | 70 °C | 16 | CERAMIC | DFP | FL16,.3 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | DFP, FL16,.3 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||
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UT6764-70PBR
Cobham Advanced Electronic Solutions
|
Check for Price Buy | No | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | MASK ROM | 8000 | 8.192 k | 3 mA | 150 µA | CMOS | R-XDIP-T28 | Not Qualified | e0 | 38535Q/M;38534H;883B | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | AEROFLEX MICROELECTRONIC SOLUTIONS | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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HN62414TT-17
Hitachi Ltd
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Check for Price Buy | Transferred | 4.1943 Mbit | 8 | 512KX8 | 5 V | 170 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | HITACHI LTD | TSOP2 | TSOP2, | 44 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||
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MSM531021BRS
LAPIS Semiconductor Co Ltd
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Check for Price Buy | No | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 100 ns | MASK ROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 50 µA | 30 µA | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP32,.6 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||
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MV23SC16-DG
Dynex Semiconductor
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Check for Price Buy | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 450 ns | MASK ROM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 100 µA | CMOS | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GEC PLESSEY SEMICONDUCTORS | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||
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MR27V852E-XXXJA
LAPIS Semiconductor Co Ltd
|
Check for Price Buy | No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 100 ns | MASK ROM | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 50 µA | 80 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-J42 | Not Qualified | e0 | 70 °C | 42 | PLASTIC/EPOXY | SOJ | SOJ42,.44 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | J BEND | 1.27 mm | DUAL | 3.75 mm | 27.3 mm | 10.16 mm | LAPIS SEMICONDUCTOR CO LTD | SOJ | SOJ, SOJ42,.44 | 42 | unknown | EAR99 | 8542.32.00.71 | ||||||||
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K3P6V1000B-GC15
Samsung Semiconductor
|
Check for Price Buy | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3.3 V | 150 ns | MASK ROM | ALSO CONFIGURABLE AS 2M X 16 | 8 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 30 µA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | 225 | 30 | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.1 mm | 28.5 mm | 12.6 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP44,.63 | 44 | compliant | EAR99 | 8542.32.00.71 |