Datasheets
TSPC750AMGB/T12LH by:

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

Part Details for TSPC750AMGB/T12LH by Atmel Corporation

Overview of TSPC750AMGB/T12LH by Atmel Corporation

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Part Details for TSPC750AMGB/T12LH

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TSPC750AMGB/T12LH Part Data Attributes

TSPC750AMGB/T12LH Atmel Corporation
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TSPC750AMGB/T12LH Atmel Corporation RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.2 mm
Speed 266 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC750AMGB/T12LH

This table gives cross-reference parts and alternative options found for TSPC750AMGB/T12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGB/T12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC750AVGB/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSXPC750AVGB/T12LH
TSXPC750AMGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSXPC750AMGB/Q12LE
TSPC750AVG12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSPC750AVG12LE
TSPC750AMGU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/T12LH vs TSPC750AMGU12LE
TSXPC750AMGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/T12LH vs TSXPC750AMGB/Q12LE
TSXPC750AVG12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/T12LH vs TSXPC750AVG12LE
MPC750ARX266LX 32-BIT, 266MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors TSPC750AMGB/T12LH vs MPC750ARX266LX
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSPC750AVGB/Q12LE
TSXPC750AMGB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSXPC750AMGB/T12LE
TSPC750AVGU/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs TSPC750AVGU/T12LH
Part Number Description Manufacturer Compare
IBM25PPC750L-GB500A2R RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM TSPC750AMGB/T12LH vs IBM25PPC750L-GB500A2R
MPC8541EPXAJEX 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSPC750AMGB/T12LH vs MPC8541EPXAJEX
XPC750PRX233LX 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor TSPC750AMGB/T12LH vs XPC750PRX233LX
TSPC750AMGS10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGB/T12LH vs TSPC750AMGS10LE
TSPC750AVGU/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/T12LH vs TSPC750AVGU/T10LE
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSPC750AMGB/T12LH vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v TSPC750AMGB/T12LH vs PCX7448VSH1267ND
PC755BMGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs PC755BMGHU350LE
PC7410MGHU450LE RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation TSPC750AMGB/T12LH vs PC7410MGHU450LE
PC755BMZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group TSPC750AMGB/T12LH vs PC755BMZFU350LE

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