Part Details for TSXPC750AMGB/Q12LE by Teledyne e2v
Overview of TSXPC750AMGB/Q12LE by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for TSXPC750AMGB/Q12LE
TSXPC750AMGB/Q12LE CAD Models
TSXPC750AMGB/Q12LE Part Data Attributes
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TSXPC750AMGB/Q12LE
Teledyne e2v
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Datasheet
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TSXPC750AMGB/Q12LE
Teledyne e2v
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL GRENOBLE | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC750AMGB/Q12LE
This table gives cross-reference parts and alternative options found for TSXPC750AMGB/Q12LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGB/Q12LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC750AMGB/T12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXPC750AMGB/Q12LE vs TSXPC750AMGB/T12LH |
| MPC750ARX266LX | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | TSXPC750AMGB/Q12LE vs MPC750ARX266LX |
| TSPC750AMGB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSXPC750AMGB/Q12LE vs TSPC750AMGB/T12LE |
| TSXPC750AMGU/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXPC750AMGB/Q12LE vs TSXPC750AMGU/T12LE |
| TSPC750AMG12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXPC750AMGB/Q12LE vs TSPC750AMG12LE |
| TSPC750AMGU/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSXPC750AMGB/Q12LE vs TSPC750AMGU/T12LE |
| TSXPC750AMGB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSXPC750AMGB/Q12LE vs TSXPC750AMGB/T12LE |
| TSPC750AMGB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXPC750AMGB/Q12LE vs TSPC750AMGB/T12LE |
| TSPC750AVG12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXPC750AMGB/Q12LE vs TSPC750AVG12LE |
| TSPC750AVG12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSXPC750AMGB/Q12LE vs TSPC750AVG12LH |