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Microcontrollers and Processors / Microprocessors / PC755BMZFU350LE
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PC755BMZFU350LE by:

RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360

Part Details for PC755BMZFU350LE by Thales Group

Overview of PC755BMZFU350LE by Thales Group

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMZFU350LE

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PC755BMZFU350LE Part Data Attributes

Parametric Data
PC755BMZFU350LE Thales Group
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PC755BMZFU350LE Thales Group RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360
Part Life Cycle Code Transferred
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA
Package Description ,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMZFU350LE

This table gives cross-reference parts and alternative options found for PC755BMZFU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZFU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IBM25PPC750L-DB0C350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25PPC750L-DB0C350W
PC755MG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PC755MG350LE
PC755BVZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMZFU350LE vs PC755BVZFU350LE
MPC755BPX350LE 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 Motorola Mobility LLC PC755BMZFU350LE vs MPC755BPX350LE
PC755VGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PC755VGHU350LE
PC755MGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PC755MGH350LE
PCX755BMZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PCX755BMZFU350LE
IBM25PPC750L-EB0B350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25PPC750L-EB0B350W
MPC755CVT350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU350LE vs MPC755CVT350
IBM25PPC750L-DB0A350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25PPC750L-DB0A350W
Part Number Description Manufacturer Compare
XPC755BPX350LD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Freescale Semiconductor PC755BMZFU350LE vs XPC755BPX350LD
PC7400VGU350LX RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC755BMZFU350LE vs PC7400VGU350LX
PC7447VGU500NB RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC755BMZFU350LE vs PC7447VGU500NB
PPC7448HX667NC 32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BMZFU350LE vs PPC7448HX667NC
PCX7448MLH1000ND RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 Teledyne e2v PC755BMZFU350LE vs PCX7448MLH1000ND
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BMZFU350LE vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v PC755BMZFU350LE vs PCX7448VSH1267ND
IBM25EMPPC750LFBE3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU350LE vs IBM25EMPPC750LFBE3000
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMZFU350LE vs TSPC750AVGB/Q12LE
TSXPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BMZFU350LE vs TSXPC750AMGSB/T12LE

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