Microcontrollers and Processors Microprocessors XPC750PRX233LX

XPC750PRX233LX by

Description: 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

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Overview of XPC750PRX233LX by Freescale Semiconductor

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Number of FFF Equivalents: ( 3 crosses )
CAD Models: ( Request Part )
Number of Functional Equivalents: ( 10 crosses )
Part Data Attributes ( Available )
Reference Designs: ( Not Available )

Where used in Applications: Industrial Automation Renewable Energy Robotics and Drones

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Part Data Attributes for XPC750PRX233LX by Freescale Semiconductor

Parametric Data

Show differences only	XPC750PRX233LX Freescale Semiconductor Buy Now	part-to-be-compared Freescale Semiconductor Buy Now
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Part Life Cycle Code	Obsolete
Ihs Manufacturer	FREESCALE SEMICONDUCTOR INC
Part Package Code	BGA
Package Description	BGA,
Pin Count	360
Reach Compliance Code	unknown
ECCN Code	3A991.A.2
HTS Code	8542.31.00.01
Additional Feature	ALSO REQUIRES 3.3V SUPPLY
Address Bus Width	32
Bit Size	32
Boundary Scan	YES
Clock Frequency-Max	83.3 MHz
External Data Bus Width	64
Format	FLOATING POINT
Integrated Cache	YES
JESD-30 Code	S-CBGA-B360
Length	25 mm
Low Power Mode	YES
Number of Terminals	360
Package Body Material	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA
Package Shape	SQUARE
Package Style	GRID ARRAY
Qualification Status	Not Qualified
Seated Height-Max	3.2 mm
Speed	233 MHz
Supply Voltage-Nom	1.9 V
Surface Mount	YES
Technology	CMOS
Terminal Form	BALL
Terminal Pitch	1.27 mm
Terminal Position	BOTTOM
Width	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC

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XPC750PRX233LX

Freescale Semiconductor

32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

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Alternate Parts for XPC750PRX233LX

This table gives cross-reference parts and alternative options found for XPC750PRX233LX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC750PRX233LX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number	Description	Manufacturer	Compare
XPC750PRX233LX	RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMIC, BGA-360	Motorola Semiconductor Products	XPC750PRX233LX vs XPC750PRX233LX
XPC750PRX233TX	32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	Freescale Semiconductor	XPC750PRX233LX vs XPC750PRX233TX
XPC750PRX233TX	32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMIC, BGA-360	Motorola Mobility LLC	XPC750PRX233LX vs XPC750PRX233TX

Part Number	Description	Manufacturer	Compare
XPC755BPX350LD	32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360	Freescale Semiconductor	XPC750PRX233LX vs XPC755BPX350LD
PC7400VGU350LX	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	Atmel Corporation	XPC750PRX233LX vs PC7400VGU350LX
PC7447VGU500NB	RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	Teledyne e2v	XPC750PRX233LX vs PC7447VGU500NB
PPC7448HX667NC	32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360	Freescale Semiconductor	XPC750PRX233LX vs PPC7448HX667NC
PCX7448MLH1000ND	RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360	Teledyne e2v	XPC750PRX233LX vs PCX7448MLH1000ND
PPC7448HX1250NC	32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360	Freescale Semiconductor	XPC750PRX233LX vs PPC7448HX1250NC
PCX7448VSH1267ND	RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360	Teledyne e2v	XPC750PRX233LX vs PCX7448VSH1267ND
IBM25EMPPC750LFBE3000	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360	IBM	XPC750PRX233LX vs IBM25EMPPC750LFBE3000
TSPC750AVGB/Q12LE	RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360	Thales Group	XPC750PRX233LX vs TSPC750AVGB/Q12LE
TSXPC750AMGSB/T12LE	RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360	Atmel Corporation	XPC750PRX233LX vs TSXPC750AMGSB/T12LE

	Part Number	Manufacturer	Description
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Overview of XPC750PRX233LX by Freescale Semiconductor

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CAD Models for XPC750PRX233LX by Freescale Semiconductor

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Part Data Attributes for XPC750PRX233LX by Freescale Semiconductor

Parametric Data