Part Details for PC755BMGHU350LE by Atmel Corporation
Overview of PC755BMGHU350LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC755BMGHU350LE
PC755BMGHU350LE CAD Models
PC755BMGHU350LE Part Data Attributes
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PC755BMGHU350LE
Atmel Corporation
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Datasheet
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PC755BMGHU350LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.24 mm | |
| Speed | 350 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BMGHU350LE
This table gives cross-reference parts and alternative options found for PC755BMGHU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMGHU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PC755BVGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PC755BMGHU350LE vs PC755BVGU350LE |
| PCX755BMGSU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BMGSU350LE |
| PCX755BMZF350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BMZF350LE |
| PCX755BVGSU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BVGSU350LE |
| XPC755BPX350LB | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Mobility LLC | PC755BMGHU350LE vs XPC755BPX350LB |
| PCX755BVG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BVG350LE |
| PCX755BMGS350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BMGS350LE |
| PCX755BMG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PC755BMGHU350LE vs PCX755BMG350LE |
| PC755BVGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PC755BMGHU350LE vs PC755BVGHU350LE |
| PC755BVG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PC755BMGHU350LE vs PC755BVG350LE |