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Microcontrollers and Processors / Microprocessors / PC755BMGHU350LE
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PC755BMGHU350LE by:

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

Part Details for PC755BMGHU350LE by Atmel Corporation

Overview of PC755BMGHU350LE by Atmel Corporation

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMGHU350LE

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PC755BMGHU350LE Part Data Attributes

Parametric Data
PC755BMGHU350LE Atmel Corporation
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PC755BMGHU350LE Atmel Corporation RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.24 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMGHU350LE

This table gives cross-reference parts and alternative options found for PC755BMGHU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMGHU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755BMG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation PC755BMGHU350LE vs PC755BMG350LE
PC755BMGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation PC755BMGHU350LE vs PC755BMGU350LE
PCX755BMGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC755BMGHU350LE vs PCX755BMGHU350LE
PCX755BVGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BMGHU350LE vs PCX755BVGU350LE
PC755BMGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BMGHU350LE vs PC755BMGU350LE
PCX755BVG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BMGHU350LE vs PCX755BVG350LE
PCX755BVZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BMGHU350LE vs PCX755BVZF350LE
PC755BMG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BMGHU350LE vs PC755BMG350LE
PC755BVGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BMGHU350LE vs PC755BVGH350LE
XPC755BPX350LB RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 Motorola Semiconductor Products PC755BMGHU350LE vs XPC755BPX350LB
Part Number Description Manufacturer Compare
XPC755BPX350LD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Freescale Semiconductor PC755BMGHU350LE vs XPC755BPX350LD
PC7400VGU350LX RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC755BMGHU350LE vs PC7400VGU350LX
PC7447VGU500NB RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC755BMGHU350LE vs PC7447VGU500NB
PPC7448HX667NC 32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BMGHU350LE vs PPC7448HX667NC
PCX7448MLH1000ND RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 Teledyne e2v PC755BMGHU350LE vs PCX7448MLH1000ND
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BMGHU350LE vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v PC755BMGHU350LE vs PCX7448VSH1267ND
IBM25EMPPC750LFBE3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMGHU350LE vs IBM25EMPPC750LFBE3000
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMGHU350LE vs TSPC750AVGB/Q12LE
TSXPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BMGHU350LE vs TSXPC750AMGSB/T12LE

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