Part Details for MPC7410THX500LE by Motorola Mobility LLC
Overview of MPC7410THX500LE by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for MPC7410THX500LE
MPC7410THX500LE CAD Models
MPC7410THX500LE Part Data Attributes:
|
|
MPC7410THX500LE
Motorola Mobility LLC
Buy Now
Datasheet
|
Compare Parts:
MPC7410THX500LE
Motorola Mobility LLC
32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
|
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.2 mm | |
| Speed | 500 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC7410THX500LE
This table gives cross-reference parts and alternative options found for MPC7410THX500LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410THX500LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC7410RX500LX | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC7410THX500LE vs MPC7410RX500LX |
| MPC7410THX500LE | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | MPC7410THX500LE vs MPC7410THX500LE |
| MC7410VU500LE | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | MPC7410THX500LE vs MC7410VU500LE |
| PC7410MG500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MPC7410THX500LE vs PC7410MG500LE |
| PC7410MGHU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | MPC7410THX500LE vs PC7410MGHU500LE |
| MPC7410VS500LE | 32-BIT, 500MHz, RISC PROCESSOR, CLGA360 | NXP Semiconductors | MPC7410THX500LE vs MPC7410VS500LE |
| PC7410MGU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | e2v technologies | MPC7410THX500LE vs PC7410MGU500LE |
| PC7410MGHU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | e2v technologies | MPC7410THX500LE vs PC7410MGHU500LE |
| PC7410VGS500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 | Atmel Corporation | MPC7410THX500LE vs PC7410VGS500LE |
| PC7410VGHU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | e2v technologies | MPC7410THX500LE vs PC7410VGHU500LE |