Findchips: Parametric Search Results for MPC7410THX500LE


Select Parts		Part Number

		MPC7410THX500LE NXP Semiconductors
		MPC7410THX500LE Rochester Electronics LLC
		MPC7410THX500LE Motorola Semiconductor Products
		MPC7410THX500LE Motorola Mobility LLC
		MPC7410THX500LE Freescale Semiconductor

				Most Relevant							Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$129.7089

Obsolete

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

NXP SEMICONDUCTORS

BGA

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price

Active

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

ROCHESTER ELECTRONICS INC

BGA,

unknown

BGA

360

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Compare

MPC7410THX500LE

NXP Semiconductors

$129.7089

Obsolete

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

NXP SEMICONDUCTORS

BGA

unknown

3A991.A.1

8542.31.00.01

NXP

MPC7410THX500LE

Rochester Electronics LLC

Check for Price

Active

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

ROCHESTER ELECTRONICS INC

BGA,

unknown

BGA

360

MPC7410THX500LE

Motorola Semiconductor Products

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

MPC7410THX500LE

Motorola Mobility LLC

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

MPC7410THX500LE

Freescale Semiconductor

Check for Price

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Parametric results for: MPC7410THX500LE under Microprocessors