Part Details for HM1-6551/883 by Intersil Corporation
Overview of HM1-6551/883 by Intersil Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for HM1-6551/883
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2156-HM1-6551/883-ND
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DigiKey | IC SRAM 1KBIT PARALLEL 22CDIP Min Qty: 11 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
91 In Stock |
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$27.5500 | Buy Now |
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Rochester Electronics | Standard SRAM, 256X4, 300ns CDIP22 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 91 |
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$23.6400 / $27.8100 | Buy Now |
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Chip1Cloud | 256 x 4 CMOS RAM | 1400 |
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RFQ |
Part Details for HM1-6551/883
HM1-6551/883 CAD Models
HM1-6551/883 Part Data Attributes:
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HM1-6551/883
Intersil Corporation
Buy Now
Datasheet
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Compare Parts:
HM1-6551/883
Intersil Corporation
256X4 STANDARD SRAM, 300ns, CDIP22, CERAMIC, DIP-22
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTERSIL CORP | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-22 | |
| Pin Count | 22 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-GDIP-T22 | |
| JESD-609 Code | e0 | |
| Memory Density | 1024 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 22 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP22,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.00001 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.0063 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 10.16 mm |
Alternate Parts for HM1-6551/883
This table gives cross-reference parts and alternative options found for HM1-6551/883. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM1-6551/883, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HM1-6551/883 | Standard SRAM, 256X4, 300ns, CMOS, CDIP22 | Harris Semiconductor | HM1-6551/883 vs HM1-6551/883 |