HM1-6551/883 vs HM1-6551/883 feature comparison

HM1-6551/883 Intersil Corporation

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HM1-6551/883 Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description CERAMIC, DIP-22 DIP-22
Pin Count 22
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 300 ns 300 ns
JESD-30 Code R-GDIP-T22 R-GDIP-T22
JESD-609 Code e0 e0
Memory Density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X4 256X4
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP22,.4 DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B 38535Q/M;38534H;883B
Seated Height-Max 5.72 mm
Standby Current-Max 0.00001 A 0.00001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.0063 mA 0.0063 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm
Base Number Matches 1 1
Additional Feature ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS
Number of Ports 1
Output Enable NO

Compare HM1-6551/883 with alternatives

Compare HM1-6551/883 with alternatives