Datasheets
DM77SR181J by:

IC 1K X 8 OTPROM, CDIP24, CERAMIC, DIP-24, Programmable ROM

Part Details for DM77SR181J by National Semiconductor Corporation

Overview of DM77SR181J by National Semiconductor Corporation

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Applications Space Technology Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Part Details for DM77SR181J

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DM77SR181J Part Data Attributes:

DM77SR181J National Semiconductor Corporation
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DM77SR181J National Semiconductor Corporation IC 1K X 8 OTPROM, CDIP24, CERAMIC, DIP-24, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Memory Density 8192 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 1024 words
Number of Words Code 1000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 1KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for DM77SR181J

This table gives cross-reference parts and alternative options found for DM77SR181J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM77SR181J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27S280PCB OTP ROM, 1KX8, 60ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD DM77SR181J vs AM27S280PCB
N82S181CN3 OTP ROM, 1KX8, 30ns, Bipolar, PDIP24, Signetics DM77SR181J vs N82S181CN3
82LS181/BJA OTP ROM, 1KX8, 120ns, Bipolar, CDIP24, YAGEO Corporation DM77SR181J vs 82LS181/BJA
63S841J OTP ROM, 2KX4, 50ns, CMOS, CDIP18, Monolithic Memories (RETIRED) DM77SR181J vs 63S841J
N82S280I IC 1K X 8 OTPROM, CDIP24, Programmable ROM NXP Semiconductors DM77SR181J vs N82S280I
M38510/20902BVA OTP ROM, 2KX4, 125ns, Bipolar, 0.25 X 1 INCH, DIP-18 e2v technologies DM77SR181J vs M38510/20902BVA
5962-8765101LA OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 e2v technologies DM77SR181J vs 5962-8765101LA
DM77S280J IC 1K X 8 OTPROM, 75 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation DM77SR181J vs DM77S280J
93Z451APC OTP ROM, 1KX8, 35ns, TTL, PDIP24, PLASTIC, DIP-24 Fairchild Semiconductor Corporation DM77SR181J vs 93Z451APC
N82HS189ANB IC 1K X 8 OTPROM, PDIP24, Programmable ROM NXP Semiconductors DM77SR181J vs N82HS189ANB

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