Datasheets
CDCVF2310MPWEP by: Texas Instruments

Enhanced Product 2.5-V to 3.3-V high performance clock buffer 24-TSSOP -55 to 125

Part Details for CDCVF2310MPWEP by Texas Instruments

Results Overview of CDCVF2310MPWEP by Texas Instruments

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Applications Aerospace and Defense

CDCVF2310MPWEP Information

CDCVF2310MPWEP by Texas Instruments is a Clock Driver.
Clock Drivers are under the broader part category of Logic Components.

Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.

Price & Stock for CDCVF2310MPWEP

Part # Distributor Description Stock Price Buy
DISTI # 296-50606-ND
DigiKey IC CLK BUF 1:10 200MHZ 24TSSOP Min Qty: 1 Lead time: 18 Weeks Container: Tube 240
In Stock
  • 1 $15.3400
  • 10 $12.1410
  • 60 $10.7467
  • 120 $10.3693
  • 300 $9.9710
  • 540 $9.7646
  • 1,020 $9.5763
$9.5763 / $15.3400 Buy Now
DISTI # 595-CDCVF2310MPWEP
Mouser Electronics Clock Buffer EP 2.5V-3.3V Hi Perf Clock Buffer RoHS: Compliant 212
  • 1 $12.7600
  • 10 $10.0100
  • 25 $9.0500
  • 120 $8.7200
  • 300 $8.4800
$8.4800 / $12.7600 Buy Now

Part Details for CDCVF2310MPWEP

CDCVF2310MPWEP CAD Models

CDCVF2310MPWEP Part Data Attributes

CDCVF2310MPWEP Texas Instruments
Buy Now Datasheet
Compare Parts:
CDCVF2310MPWEP Texas Instruments Enhanced Product 2.5-V to 3.3-V high performance clock buffer 24-TSSOP -55 to 125
Select a part to compare:
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code TSSOP
Package Description TSSOP-24
Pin Count 24
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family CDCV
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G24
JESD-609 Code e4
Length 7.8 mm
Logic IC Type LOW SKEW CLOCK DRIVER
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Number of Functions 2
Number of Inverted Outputs
Number of Terminals 24
Number of True Outputs 5
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4 ns
Propagation Delay (tpd) 4 ns
Qualification Status Not Qualified
Same Edge Skew-Max (tskwd) 0.17 ns
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Temperature Grade MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
fmax-Min 200 MHz

Alternate Parts for CDCVF2310MPWEP

This table gives cross-reference parts and alternative options found for CDCVF2310MPWEP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CDCVF2310MPWEP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CDCVF2310MPWREP Texas Instruments $5.8422 Enhanced Product 2.5-V to 3.3-V high performance clock buffer 24-TSSOP -55 to 125 CDCVF2310MPWEP vs CDCVF2310MPWREP
V62/13603-01XE Texas Instruments Check for Price Enhanced Product 2.5-V to 3.3-V high performance clock buffer 24-TSSOP -55 to 125 CDCVF2310MPWEP vs V62/13603-01XE
CDCVF2310PWG4 Texas Instruments Check for Price High performance 1:10 clock buffer for general purpose applications with support up to 105C 24-TSSOP -40 to 85 CDCVF2310MPWEP vs CDCVF2310PWG4
V62/13603-01XE-T Texas Instruments Check for Price Enhanced Product 2.5-V to 3.3-V high performance clock buffer 24-TSSOP -55 to 125 CDCVF2310MPWEP vs V62/13603-01XE-T
CDCVF2310PWRG4 Texas Instruments Check for Price High performance 1:10 clock buffer for general purpose applications with support up to 105C 24-TSSOP -40 to 85 CDCVF2310MPWEP vs CDCVF2310PWRG4
CDCVF2310PWR Texas Instruments $4.2402 High performance 1:10 clock buffer for general purpose applications with support up to 105C 24-TSSOP -40 to 85 CDCVF2310MPWEP vs CDCVF2310PWR
IDT5V2310PGI Integrated Device Technology Inc Check for Price Low Skew Clock Driver, 5V Series, 10 True Output(s), 0 Inverted Output(s), CMOS, PDSO24, TSSOP-24 CDCVF2310MPWEP vs IDT5V2310PGI
5V2310PGGI8 Integrated Device Technology Inc Check for Price TSSOP-24, Reel CDCVF2310MPWEP vs 5V2310PGGI8
IDT5V2310PGGI8 Integrated Device Technology Inc Check for Price Low Skew Clock Driver, 10 True Output(s), 0 Inverted Output(s), CMOS, PDSO24, TSSOP-24 CDCVF2310MPWEP vs IDT5V2310PGGI8
CY2310BNZPVC-1T Cypress Semiconductor Check for Price Low Skew Clock Driver, 2310 Series, 10 True Output(s), 0 Inverted Output(s), CMOS, PDSO28, 5.30 MM, SSOP-28 CDCVF2310MPWEP vs CY2310BNZPVC-1T

CDCVF2310MPWEP Related Parts

CDCVF2310MPWEP Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VCC first, followed by VCCIO, and then the input clock signal. This ensures proper device operation and prevents latch-up.

  • To optimize the clock tree design, use a balanced clock tree architecture, minimize clock signal routing distance, and use a clock buffer or repeater to reduce signal degradation. Additionally, consider using a clock distribution network with a low-skew, low-jitter clock source.

  • The maximum frequency of operation for the CDCVF2310 is 231.4 MHz. However, the actual operating frequency may be limited by the specific application, PCB design, and environmental conditions.

  • To handle clock domain crossing, use a synchronizer circuit or a FIFO-based design to transfer data between clock domains. Ensure that the clock domains are properly synchronized, and consider using a clock domain crossing (CDC) circuit or a asynchronous FIFO to handle data transfer.

  • To ensure proper thermal management, provide adequate heat sinking, use a thermal interface material, and ensure good airflow around the device. The maximum junction temperature (TJ) is 150°C, and the device should be operated within the recommended operating temperature range of -40°C to 85°C.