Part Details for AS6C8016A-55BIN by Alliance Memory Inc
Overview of AS6C8016A-55BIN by Alliance Memory Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AS6C8016A-55BIN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
AS6C8016A-55BIN
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Avnet Americas | SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 55ns 48-Pin FBGA - Trays (Alt: AS6C8016A-55BIN) RoHS: Not Compliant Min Qty: 300 Package Multiple: 300 Container: Tray | 0 |
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RFQ | |
DISTI #
AS6C8016A-55BIN
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Avnet Americas | SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 55ns 48-Pin FBGA - Trays (Alt: AS6C8016A-55BIN) RoHS: Not Compliant Min Qty: 300 Package Multiple: 300 Container: Tray | 0 |
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RFQ |
Part Details for AS6C8016A-55BIN
AS6C8016A-55BIN CAD Models
AS6C8016A-55BIN Part Data Attributes:
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AS6C8016A-55BIN
Alliance Memory Inc
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Datasheet
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AS6C8016A-55BIN
Alliance Memory Inc
Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, 0.75 MM PITCH, ROHS COMPLIANT, FPBGA-48
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Part Package Code | BGA | |
Package Description | VFBGA, | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Samacsys Manufacturer | Alliance Memory | |
Access Time-Max | 55 ns | |
JESD-30 Code | R-PBGA-B48 | |
Length | 10 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 8 mm |
Alternate Parts for AS6C8016A-55BIN
This table gives cross-reference parts and alternative options found for AS6C8016A-55BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS6C8016A-55BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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W963B6BBN70E | Pseudo Static RAM, 512KX16, 65ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, TFBGA-48 | Winbond Electronics Corp | AS6C8016A-55BIN vs W963B6BBN70E |
CY62157DV30LL-45BVI | Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, FBGA-48 | Cypress Semiconductor | AS6C8016A-55BIN vs CY62157DV30LL-45BVI |
KM616FU8110FI-70 | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 8 X 12 MM, 0.75 MM PITCH, FBGA-48 | Samsung Semiconductor | AS6C8016A-55BIN vs KM616FU8110FI-70 |
HY62UF16804B-DF70C | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, FBGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62UF16804B-DF70C |
HY62LF16804B-DF70C | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, FBGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62LF16804B-DF70C |
HY62LF16806A-DM100I | Standard SRAM, 512KX16, 100ns, CMOS, PBGA48, UBGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62LF16806A-DM100I |
HY62UF16804A-DM55C | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62UF16804A-DM55C |
HY62UF16803ALLM-70I | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62UF16803ALLM-70I |
HY62LF16804A-DM10I | Standard SRAM, 512KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | AS6C8016A-55BIN vs HY62LF16804A-DM10I |
M68AR512DN55ZB6 | 512KX16 STANDARD SRAM, 55ns, PBGA48, 6 X 7 MM, 0.75 MM PITCH, TFBGA-48 | STMicroelectronics | AS6C8016A-55BIN vs M68AR512DN55ZB6 |