AS6C8016A-55BIN vs HY62UF16804A-DM55C feature comparison

AS6C8016A-55BIN Alliance Memory Inc

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HY62UF16804A-DM55C SK Hynix Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC SK HYNIX INC
Part Package Code BGA BGA
Package Description VFBGA, VFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 10 mm 8.5 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.95 mm
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 7.4 mm
Base Number Matches 2 1
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Voltage-Min 1.2 V
Supply Current-Max 0.05 mA
Terminal Finish TIN LEAD

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