Part Details for AM27PS181ADC by AMD
Overview of AM27PS181ADC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27PS181ADC
AM27PS181ADC CAD Models
AM27PS181ADC Part Data Attributes:
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AM27PS181ADC
AMD
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Datasheet
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AM27PS181ADC
AMD
OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP24,.6 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 15 ns | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 32.0675 mm | |
Memory Density | 16384 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 1024 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 4KX4 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27PS181ADC
This table gives cross-reference parts and alternative options found for AM27PS181ADC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27PS181ADC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DM77S181AJ | 1KX8 OTPROM, 65ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | AM27PS181ADC vs DM77S181AJ |
AM27PS181APCB | OTP ROM, 1KX8, 65ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27PS181ADC vs AM27PS181APCB |
AM27PS281ADCB | OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM27PS181ADC vs AM27PS281ADCB |
AM27PS181APC | OTP ROM, 1KX8, 65ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27PS181ADC vs AM27PS181APC |
AM27PS281ADC | OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM27PS181ADC vs AM27PS281ADC |
TBP28S86ANW | 1KX8 OTPROM, 65ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Texas Instruments | AM27PS181ADC vs TBP28S86ANW |