Datasheets
AM27PS181ADC by: AMD

OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24

Part Details for AM27PS181ADC by AMD

Overview of AM27PS181ADC by AMD

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for AM27PS181ADC

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AM27PS181ADC Part Data Attributes:

AM27PS181ADC AMD
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AM27PS181ADC AMD OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 15 ns
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 32.0675 mm
Memory Density 16384 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 24
Number of Words 1024 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 4KX4
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27PS181ADC

This table gives cross-reference parts and alternative options found for AM27PS181ADC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27PS181ADC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DM77S181AJ 1KX8 OTPROM, 65ns, CDIP24, CERAMIC, DIP-24 Texas Instruments AM27PS181ADC vs DM77S181AJ
AM27PS181APCB OTP ROM, 1KX8, 65ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27PS181ADC vs AM27PS181APCB
AM27PS281ADCB OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM27PS181ADC vs AM27PS281ADCB
AM27PS181APC OTP ROM, 1KX8, 65ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27PS181ADC vs AM27PS181APC
AM27PS281ADC OTP ROM, 1KX8, 65ns, Bipolar, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM27PS181ADC vs AM27PS281ADC
TBP28S86ANW 1KX8 OTPROM, 65ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 Texas Instruments AM27PS181ADC vs TBP28S86ANW
Part Number Description Manufacturer Compare
AM27S280PCB OTP ROM, 1KX8, 60ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD AM27PS181ADC vs AM27S280PCB
N82S181CN3 OTP ROM, 1KX8, 30ns, Bipolar, PDIP24, Signetics AM27PS181ADC vs N82S181CN3
82LS181/BJA OTP ROM, 1KX8, 120ns, Bipolar, CDIP24, YAGEO Corporation AM27PS181ADC vs 82LS181/BJA
63S841J OTP ROM, 2KX4, 50ns, CMOS, CDIP18, Monolithic Memories (RETIRED) AM27PS181ADC vs 63S841J
N82S280I IC 1K X 8 OTPROM, CDIP24, Programmable ROM NXP Semiconductors AM27PS181ADC vs N82S280I
M38510/20902BVA OTP ROM, 2KX4, 125ns, Bipolar, 0.25 X 1 INCH, DIP-18 e2v technologies AM27PS181ADC vs M38510/20902BVA
5962-8765101LA OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 e2v technologies AM27PS181ADC vs 5962-8765101LA
DM77S280J IC 1K X 8 OTPROM, 75 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation AM27PS181ADC vs DM77S280J
93Z451APC OTP ROM, 1KX8, 35ns, TTL, PDIP24, PLASTIC, DIP-24 Fairchild Semiconductor Corporation AM27PS181ADC vs 93Z451APC
N82HS189ANB IC 1K X 8 OTPROM, PDIP24, Programmable ROM NXP Semiconductors AM27PS181ADC vs N82HS189ANB

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