Datasheets
AM2732B-200/BJA by: AMD

UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24

Part Details for AM2732B-200/BJA by AMD

Overview of AM2732B-200/BJA by AMD

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Applications Consumer Electronics

Price & Stock for AM2732B-200/BJA

Part # Distributor Description Stock Price Buy
Bristol Electronics   50
RFQ
Quest Components   7
  • 1 $49.6620
  • 6 $47.1789
$47.1789 / $49.6620 Buy Now

Part Details for AM2732B-200/BJA

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AM2732B-200/BJA Part Data Attributes

AM2732B-200/BJA AMD
Buy Now Datasheet
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AM2732B-200/BJA AMD UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 32.0675 mm
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.588 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM2732B-200/BJA

This table gives cross-reference parts and alternative options found for AM2732B-200/BJA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2732B-200/BJA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM2732B-200DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM2732B-200/BJA vs AM2732B-200DC
TMS27C32-2JE4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS27C32-2JE4
QD2732A-20 UVPROM, 4KX8, 200ns, NMOS, CDIP24, CERDIP-24 Intel Corporation AM2732B-200/BJA vs QD2732A-20
AM2732B-205DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD AM2732B-200/BJA vs AM2732B-205DC
TMS27C32-20JL4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS27C32-20JL4
QD2732A-2 UVPROM, 4KX8, 200ns, NMOS, CDIP24, CERDIP-24 Intel Corporation AM2732B-200/BJA vs QD2732A-2
TMS2732A-20JL 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS2732A-20JL
NMC27C32BQ200 IC 4K X 8 UVPROM, 200 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM Texas Instruments AM2732B-200/BJA vs NMC27C32BQ200
TMS2732A-20JP4 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS2732A-20JP4
M2732A-2F6 4KX8 UVPROM, 200ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics AM2732B-200/BJA vs M2732A-2F6
Part Number Description Manufacturer Compare
5962-9065804JX UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc AM2732B-200/BJA vs 5962-9065804JX
TMS27C32-120JE 4KX8 UVPROM, 120ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS27C32-120JE
TMS27C32JE 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS27C32JE
F353345S MASK ROM, 4KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation AM2732B-200/BJA vs F353345S
S6333C-C MASK ROM, 4KX8, 120ns, CMOS, CDIP24 Gould Ami AM2732B-200/BJA vs S6333C-C
TMS2732A-20JL 4KX8 UVPROM, 200ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS2732A-20JL
TMS2732A-17JP4 4KX8 UVPROM, 170ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments AM2732B-200/BJA vs TMS2732A-17JP4
AM9232BDMB33328 MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 AMD AM2732B-200/BJA vs AM9232BDMB33328
AM9232BDMB33512 MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 AMD AM2732B-200/BJA vs AM9232BDMB33512
CY7C243-20WI UVPROM, 4KX8, 20ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor AM2732B-200/BJA vs CY7C243-20WI

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