Part Details for 5962-9065804JX by Waferscale Integration Inc
Overview of 5962-9065804JX by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Electronic Manufacturing
Automotive
Part Details for 5962-9065804JX
5962-9065804JX CAD Models
5962-9065804JX Part Data Attributes:
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5962-9065804JX
Waferscale Integration Inc
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5962-9065804JX
Waferscale Integration Inc
UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
| Package Description | CERAMIC, DIP-24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Standby Current-Max | 0.035 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for 5962-9065804JX
This table gives cross-reference parts and alternative options found for 5962-9065804JX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9065804JX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| F353330S | MASK ROM, 4KX8, 300ns, NMOS, CDIP24, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | 5962-9065804JX vs F353330S |
| WS57C43B-55TMB | UVPROM, 4KX8, 55ns, CMOS, CDIP24, | Waferscale Integration Inc | 5962-9065804JX vs WS57C43B-55TMB |
| 5962-9065803JX | UVPROM, 4KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | 5962-9065804JX vs 5962-9065803JX |
| AM27C43-35DC | UVPROM, 4KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, DIP-24 | AMD | 5962-9065804JX vs AM27C43-35DC |
| HB23C32C-Y-000 | MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 | Hughes Aircraft | 5962-9065804JX vs HB23C32C-Y-000 |
| 5962-9065804JA | UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 | Waferscale Integration Inc | 5962-9065804JX vs 5962-9065804JA |
| NMC27C32BQE250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | 5962-9065804JX vs NMC27C32BQE250 |
| WS57C43C-25T | 4KX8 UVPROM, 25ns, CDIP24, 0.300 INCH, CERDIP-24 | STMicroelectronics | 5962-9065804JX vs WS57C43C-25T |
| WS57C43B-45TMB | UVPROM, 4KX8, 45ns, CMOS, CDIP24, | Waferscale Integration Inc | 5962-9065804JX vs WS57C43B-45TMB |
| M2732A-25F1 | 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | 5962-9065804JX vs M2732A-25F1 |