Datasheets
AM9232BDMB33328 by: AMD

MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24

Part Details for AM9232BDMB33328 by AMD

Overview of AM9232BDMB33328 by AMD

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Applications Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Part Details for AM9232BDMB33328

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AM9232BDMB33328 Part Data Attributes:

AM9232BDMB33328 AMD
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AM9232BDMB33328 AMD MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 450 ns
JESD-30 Code R-CDIP-T24
Length 30.099 mm
Memory Density 32768 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM9232BDMB33328

This table gives cross-reference parts and alternative options found for AM9232BDMB33328. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM9232BDMB33328, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
F353245P MASK ROM, 4KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 Fairchild Semiconductor Corporation AM9232BDMB33328 vs F353245P
AM9233BDC MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 AMD AM9232BDMB33328 vs AM9233BDC
F68332S MASK ROM, 4KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation AM9232BDMB33328 vs F68332S
AM9233BPC MASK ROM, 4KX8, 450ns, MOS, PDIP24, PLASTIC, DIP-24 AMD AM9232BDMB33328 vs AM9233BPC
AM9232BCC MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, CERDIP-24 AMD AM9232BDMB33328 vs AM9232BCC
AM9232BPC MASK ROM, 4KX8, 450ns, MOS, PDIP24, PLASTIC, DIP-24 AMD AM9232BDMB33328 vs AM9232BPC
AM9233BCC MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, CERDIP-24 AMD AM9232BDMB33328 vs AM9233BCC
AM9232BDM MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 AMD AM9232BDMB33328 vs AM9232BDM
Part Number Description Manufacturer Compare
F353330S MASK ROM, 4KX8, 300ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation AM9232BDMB33328 vs F353330S
WS57C43B-55TMB UVPROM, 4KX8, 55ns, CMOS, CDIP24, Waferscale Integration Inc AM9232BDMB33328 vs WS57C43B-55TMB
5962-9065803JX UVPROM, 4KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc AM9232BDMB33328 vs 5962-9065803JX
AM27C43-35DC UVPROM, 4KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, DIP-24 AMD AM9232BDMB33328 vs AM27C43-35DC
HB23C32C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft AM9232BDMB33328 vs HB23C32C-Y-000
5962-9065804JA UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc AM9232BDMB33328 vs 5962-9065804JA
NMC27C32BQE250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation AM9232BDMB33328 vs NMC27C32BQE250
WS57C43C-25T 4KX8 UVPROM, 25ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics AM9232BDMB33328 vs WS57C43C-25T
WS57C43B-45TMB UVPROM, 4KX8, 45ns, CMOS, CDIP24, Waferscale Integration Inc AM9232BDMB33328 vs WS57C43B-45TMB
M2732A-25F1 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics AM9232BDMB33328 vs M2732A-25F1

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