Part Details for TD27128 by Intel Corporation
Overview of TD27128 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Education and Research
Computing and Data Storage
Energy and Power Systems
Part Details for TD27128
TD27128 CAD Models
TD27128 Part Data Attributes
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TD27128
Intel Corporation
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Datasheet
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TD27128
Intel Corporation
UVPROM, 16KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.084 mm | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 21 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for TD27128
This table gives cross-reference parts and alternative options found for TD27128. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TD27128, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| LH57128J-25 | UVPROM, 16KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Sharp Corp | TD27128 vs LH57128J-25 |
| TMS27C128JL | 131 072-Bit UV Erasable Programmable Read-Only Memory 28-CDIP | Texas Instruments | TD27128 vs TMS27C128JL |
| DC27128-25 | UVPROM, 16KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | LSI Corporation | TD27128 vs DC27128-25 |
| 27C128-25/J | 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | TD27128 vs 27C128-25/J |
| MBM27128-25Z | UVPROM, 16KX8, 250ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | TD27128 vs MBM27128-25Z |
| TMS27C128JL4 | 16KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | TD27128 vs TMS27C128JL4 |
| AM27C128-255DC | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | TD27128 vs AM27C128-255DC |
| AM27C128-255DE | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | TD27128 vs AM27C128-255DE |
| TMS27C128JE4 | 16KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | TD27128 vs TMS27C128JE4 |
| NMC27C128BQ250 | IC 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | TD27128 vs NMC27C128BQ250 |