TD27128 vs AM27128A-45LI feature comparison

TD27128 Intel Corporation

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AM27128A-45LI AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP QFJ
Package Description HERMETIC SEALED, CERAMIC, DIP-28 QCCN, LCC32,.45X.55
Pin Count 28 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 250 ns 450 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-CQCC-N32
JESD-609 Code e0 e0
Length 37.084 mm 13.97 mm
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP QCCN
Package Equivalence Code DIP28,.6 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V 12.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.556 mm
Supply Current-Max 0.14 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS NMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 11.43 mm
Base Number Matches 9 2
Pbfree Code No

Compare TD27128 with alternatives

Compare AM27128A-45LI with alternatives