TD27128
vs
AM27C128-255DC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
HERMETIC SEALED, CERAMIC, DIP-28
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
250 ns
250 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
JESD-609 Code
e0
e0
Length
37.084 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16KX8
16KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
21 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.14 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
9
2
Standby Current-Max
0.0001 A
Compare TD27128 with alternatives
Compare AM27C128-255DC with alternatives