There are no models available for this part yet.
Overview of QD2764-25 by Intel Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Aerospace and Defense
Healthcare
Telecommunications
CAD Models for QD2764-25 by Intel Corporation
Part Data Attributes for QD2764-25 by Intel Corporation
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTEL CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP, DIP28,.6
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
250 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T28
|
|
JESD-609 Code
|
e0
|
|
Length
|
37.084 mm
|
|
Memory Density
|
65536 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
28
|
|
Number of Words
|
8192 words
|
|
Number of Words Code
|
8000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
8KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Equivalence Code
|
DIP28,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
21 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.08 mm
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
NMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for QD2764-25
This table gives cross-reference parts and alternative options found for QD2764-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD2764-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C64-25JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | QD2764-25 vs TMS27C64-25JE |
| AM27C64-250DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764-25 vs AM27C64-250DIB |
| AM27C64-250DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764-25 vs AM27C64-250DE |
| DM2764-25/B | UVPROM, 8KX8, 250ns, NMOS, CDIP28 | LSI Corporation | QD2764-25 vs DM2764-25/B |
| 27C64MQ7B/Y25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | QD2764-25 vs 27C64MQ7B/Y25 |
| AM27C64-255DEB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764-25 vs AM27C64-255DEB |
| TD2764 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | QD2764-25 vs TD2764 |
| 27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | QD2764-25 vs 27C64MQB/B25 |
| TMS27C64JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | QD2764-25 vs TMS27C64JL |
| AM27C64-255DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD2764-25 vs AM27C64-255DE |