Part Details for AM27C64-250DIB by AMD
Overview of AM27C64-250DIB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for AM27C64-250DIB
AM27C64-250DIB CAD Models
AM27C64-250DIB Part Data Attributes
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AM27C64-250DIB
AMD
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Datasheet
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AM27C64-250DIB
AMD
UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-GDIP-T28 | |
Length | 37.1475 mm | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for AM27C64-250DIB
This table gives cross-reference parts and alternative options found for AM27C64-250DIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-250DIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TMS27C64-25JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C64-250DIB vs TMS27C64-25JE |
QD2764-25 | UVPROM, 8KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-250DIB vs QD2764-25 |
AM27C64-250DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250DIB vs AM27C64-250DE |
DM2764-25/B | UVPROM, 8KX8, 250ns, NMOS, CDIP28 | LSI Corporation | AM27C64-250DIB vs DM2764-25/B |
27C64MQ7B/Y25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C64-250DIB vs 27C64MQ7B/Y25 |
AM27C64-255DEB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250DIB vs AM27C64-255DEB |
TD2764 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-250DIB vs TD2764 |
27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | AM27C64-250DIB vs 27C64MQB/B25 |
TMS27C64JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C64-250DIB vs TMS27C64JL |
AM27C64-255DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250DIB vs AM27C64-255DE |