There are no models available for this part yet.
Overview of AM27C64-250/BXA by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
CAD Models for AM27C64-250/BXA by AMD
Part Data Attributes for AM27C64-250/BXA by AMD
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP, DIP28,.6
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
250 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T28
|
|
JESD-609 Code
|
e0
|
|
Length
|
37.1475 mm
|
|
Memory Density
|
65536 bit
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|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
28
|
|
Number of Words
|
8192 words
|
|
Number of Words Code
|
8000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
8KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Equivalence Code
|
DIP28,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
12.75 V
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
38535Q/M;38534H;883B
|
|
Seated Height-Max
|
5.588 mm
|
|
Standby Current-Max
|
0.00012 A
|
|
Supply Current-Max
|
0.03 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for AM27C64-250/BXA
This table gives cross-reference parts and alternative options found for AM27C64-250/BXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-250/BXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C64-25JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C64-250/BXA vs TMS27C64-25JE |
| AM27C64-250DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250/BXA vs AM27C64-250DIB |
| QD2764-25 | UVPROM, 8KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-250/BXA vs QD2764-25 |
| AM27C64-250DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250/BXA vs AM27C64-250DE |
| DM2764-25/B | UVPROM, 8KX8, 250ns, NMOS, CDIP28 | LSI Corporation | AM27C64-250/BXA vs DM2764-25/B |
| 27C64MQ7B/Y25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C64-250/BXA vs 27C64MQ7B/Y25 |
| AM27C64-255DEB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-250/BXA vs AM27C64-255DEB |
| TD2764 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-250/BXA vs TD2764 |
| 27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | AM27C64-250/BXA vs 27C64MQB/B25 |
| TMS27C64JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C64-250/BXA vs TMS27C64JL |