Part Details for 27C64MQ7B/Y25 by Thales Group
Overview of 27C64MQ7B/Y25 by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for 27C64MQ7B/Y25
27C64MQ7B/Y25 CAD Models
27C64MQ7B/Y25 Part Data Attributes
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27C64MQ7B/Y25
Thales Group
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Datasheet
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27C64MQ7B/Y25
Thales Group
UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | , | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | CECC90000B | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 27C64MQ7B/Y25
This table gives cross-reference parts and alternative options found for 27C64MQ7B/Y25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C64MQ7B/Y25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C64-25JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27C64MQ7B/Y25 vs TMS27C64-25JE |
| AM27C64-250DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ7B/Y25 vs AM27C64-250DIB |
| QD2764-25 | UVPROM, 8KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | 27C64MQ7B/Y25 vs QD2764-25 |
| AM27C64-250DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ7B/Y25 vs AM27C64-250DE |
| DM2764-25/B | UVPROM, 8KX8, 250ns, NMOS, CDIP28 | LSI Corporation | 27C64MQ7B/Y25 vs DM2764-25/B |
| AM27C64-255DEB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ7B/Y25 vs AM27C64-255DEB |
| TD2764 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | 27C64MQ7B/Y25 vs TD2764 |
| 27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 27C64MQ7B/Y25 vs 27C64MQB/B25 |
| TMS27C64JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27C64MQ7B/Y25 vs TMS27C64JL |
| AM27C64-255DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ7B/Y25 vs AM27C64-255DE |