Datasheets
PC755VGS400LE by:

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for PC755VGS400LE by Teledyne e2v

Overview of PC755VGS400LE by Teledyne e2v

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755VGS400LE

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PC755VGS400LE Part Data Attributes

PC755VGS400LE Teledyne e2v
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PC755VGS400LE Teledyne e2v RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-X360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 400 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755VGS400LE

This table gives cross-reference parts and alternative options found for PC755VGS400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755VGS400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755VGS400LE vs PC755VGSU400LE
PC755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755VGS400LE vs PC755MGS400LE
PC755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755CVGS400LE
PC755BVGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755BVGSU400LE
PC755BVGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CGA-360 Teledyne e2v PC755VGS400LE vs PC755BVGSU400LE
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755VGSU400LE
PC755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755MGS400LE
PC755BMGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755BMGSU400LE
PC755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755VGS400LE vs PC755CVGS400LE
PC755MGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755VGS400LE vs PC755MGSU400LE
Part Number Description Manufacturer Compare
IBM25PPC750L-FB0B400W RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755VGS400LE vs IBM25PPC750L-FB0B400W
PC755VG400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755VGS400LE vs PC755VG400LE
PCX755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755VGS400LE vs PCX755CVGS400LE
PCX755CVGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC755VGS400LE vs PCX755CVGH400LE
PC755VGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755VGS400LE vs PC755VGH400LE
IBM25EMPPC750LFBC4000 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755VGS400LE vs IBM25EMPPC750LFBC4000
PCX755MZFU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755VGS400LE vs PCX755MZFU400LE
PC755VZF400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755VGS400LE vs PC755VZF400LE
PCX755CVGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755VGS400LE vs PCX755CVGSU400LE
PCX755MGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755VGS400LE vs PCX755MGSU400LE

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