Microcontrollers and Processors
PC755BVGSU400LE
Description: RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CGA-360

Overview of PC755BVGSU400LE by Teledyne e2v

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Where used in Applications: Education and Research Industrial Automation Telecommunications Electronic Manufacturing

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Part Data Attributes for PC755BVGSU400LE by Teledyne e2v

PC755BVGSU400LE
Teledyne e2v
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
E2V TECHNOLOGIES PLC
Part Package Code
CGA
Package Description
CGA,
Pin Count
360
Reach Compliance Code
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
100 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-X360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Operating Temperature-Max
110 °C
Operating Temperature-Min
40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
CGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
4.2 mm
Speed
400 MHz
Supply Voltage-Max
2.1 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
2 V
Surface Mount
YES
Technology
CMOS
Terminal Form
UNSPECIFIED
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
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  1. PC755BVGSU400LE
    Teledyne e2v
    RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CGA-360
    VS

Alternate Parts for PC755BVGSU400LE

This table gives cross-reference parts and alternative options found for PC755BVGSU400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BVGSU400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VGSU400LE
PC755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755BVGSU400LE vs PC755MGS400LE
PC755VGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VGS400LE
PC755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755CVGS400LE
PC755BVGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755BVGSU400LE
PC755VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755VGSU400LE
PC755MGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755MGS400LE
PC755BMGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755BMGSU400LE
PC755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755BVGSU400LE vs PC755CVGS400LE
PC755MGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGSU400LE vs PC755MGSU400LE
Part Number Description Manufacturer Compare
PC755VGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VGS400LE
IBM25PPC750L-FB0B400W RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BVGSU400LE vs IBM25PPC750L-FB0B400W
PC755VG400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VG400LE
PCX755CVGS400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755BVGSU400LE vs PCX755CVGS400LE
PCX755CVGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC755BVGSU400LE vs PCX755CVGH400LE
PC755VGH400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VGH400LE
IBM25EMPPC750LFBC4000 RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BVGSU400LE vs IBM25EMPPC750LFBC4000
PCX755MZFU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BVGSU400LE vs PCX755MZFU400LE
PC755VZF400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v PC755BVGSU400LE vs PC755VZF400LE
PCX755CVGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755BVGSU400LE vs PCX755CVGSU400LE

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