PC755VGS400LE vs PC755CVGS400LE feature comparison

PC755VGS400LE Teledyne e2v

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PC755CVGS400LE Atmel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer E2V TECHNOLOGIES PLC ATMEL CORP
Part Package Code CGA CGA
Package Description CGA, CGA,
Pin Count 360 360
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-X360 S-CBGA-X360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code CGA CGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 400 MHz 400 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form UNSPECIFIED UNSPECIFIED
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare PC755VGS400LE with alternatives

Compare PC755CVGS400LE with alternatives