Part Details for PCX755CVGH400LE by Teledyne e2v
Overview of PCX755CVGH400LE by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PCX755CVGH400LE
PCX755CVGH400LE CAD Models
PCX755CVGH400LE Part Data Attributes
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PCX755CVGH400LE
Teledyne e2v
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Datasheet
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PCX755CVGH400LE
Teledyne e2v
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.24 mm | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755CVGH400LE
This table gives cross-reference parts and alternative options found for PCX755CVGH400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755CVGH400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC755BRX400LB | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | PCX755CVGH400LE vs XPC755BRX400LB |
| PC755CMGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PCX755CVGH400LE vs PC755CMGU400LE |
| PC755CMGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PCX755CVGH400LE vs PC755CMGU400LE |
| PC755CMGSU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | PCX755CVGH400LE vs PC755CMGSU400LE |
| PC755CVGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PCX755CVGH400LE vs PC755CVGHU400LE |
| PCX755CMZFU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | PCX755CVGH400LE vs PCX755CMZFU400LE |
| PCX755CVGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | Teledyne e2v | PCX755CVGH400LE vs PCX755CVGHU400LE |
| PCX755CVGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PCX755CVGH400LE vs PCX755CVGU400LE |
| PC755CVG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, BGA-360 | Teledyne e2v | PCX755CVGH400LE vs PC755CVG400LE |
| PC755CVGSU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CI-CGA-360 | Teledyne e2v | PCX755CVGH400LE vs PC755CVGSU400LE |