Part Details for NMC27C256BQE200 by National Semiconductor Corporation
Overview of NMC27C256BQE200 by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for NMC27C256BQE200
NMC27C256BQE200 CAD Models
NMC27C256BQE200 Part Data Attributes
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NMC27C256BQE200
National Semiconductor Corporation
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Datasheet
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NMC27C256BQE200
National Semiconductor Corporation
IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | WDIP, DIP28,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.75 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for NMC27C256BQE200
This table gives cross-reference parts and alternative options found for NMC27C256BQE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C256BQE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C256-200DCB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NMC27C256BQE200 vs AM27C256-200DCB |
MBM27C256A-20WZ | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | NMC27C256BQE200 vs MBM27C256A-20WZ |
AS27C256-20JM | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | NMC27C256BQE200 vs AS27C256-20JM |
AM27C256-200DI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | NMC27C256BQE200 vs AM27C256-200DI |
NM27C256QE200 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Rochester Electronics LLC | NMC27C256BQE200 vs NM27C256QE200 |
NMC27C256BQ200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | NMC27C256BQE200 vs NMC27C256BQ200 |
LC87C257-200V10 | UVPROM, 32KX8, 200ns, MOS, CDIP28, CERDIP-28 | Intel Corporation | NMC27C256BQE200 vs LC87C257-200V10 |
MBM27C256A-20WZ | 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 | FUJITSU Limited | NMC27C256BQE200 vs MBM27C256A-20WZ |
AM27C256-205DC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NMC27C256BQE200 vs AM27C256-205DC |
27C256-20/J | 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | NMC27C256BQE200 vs 27C256-20/J |