Datasheets
NMC27C256BQE200 by:

IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM

Part Details for NMC27C256BQE200 by National Semiconductor Corporation

Overview of NMC27C256BQE200 by National Semiconductor Corporation

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Applications Consumer Electronics

Part Details for NMC27C256BQE200

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NMC27C256BQE200 Part Data Attributes

NMC27C256BQE200 National Semiconductor Corporation
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NMC27C256BQE200 National Semiconductor Corporation IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description WDIP, DIP28,.6
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C256BQE200

This table gives cross-reference parts and alternative options found for NMC27C256BQE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C256BQE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C256-200DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256BQE200 vs AM27C256-200DCB
MBM27C256A-20WZ UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited NMC27C256BQE200 vs MBM27C256A-20WZ
AS27C256-20JM UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components NMC27C256BQE200 vs AS27C256-20JM
AM27C256-200DI UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion NMC27C256BQE200 vs AM27C256-200DI
NM27C256QE200 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Rochester Electronics LLC NMC27C256BQE200 vs NM27C256QE200
NMC27C256BQ200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C256BQE200 vs NMC27C256BQ200
LC87C257-200V10 UVPROM, 32KX8, 200ns, MOS, CDIP28, CERDIP-28 Intel Corporation NMC27C256BQE200 vs LC87C257-200V10
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited NMC27C256BQE200 vs MBM27C256A-20WZ
AM27C256-205DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256BQE200 vs AM27C256-205DC
27C256-20/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NMC27C256BQE200 vs 27C256-20/J
Part Number Description Manufacturer Compare
AM27C256-150DE UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256BQE200 vs AM27C256-150DE
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation NMC27C256BQE200 vs 27C256/BXA-20
LD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation NMC27C256BQE200 vs LD27C256-200V10
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256BQE200 vs AM27C256-205DCB
NMC27C256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C256BQE200 vs NMC27C256Q200
TD27256-20 UVPROM, 32KX8, 200ns, NMOS, CDIP28, CERDIP-28 Intel Corporation NMC27C256BQE200 vs TD27256-20
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd NMC27C256BQE200 vs FT27C256R-20LM
NMC27C256BN20 IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C256BQE200 vs NMC27C256BN20
TMX27PC256-20NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments NMC27C256BQE200 vs TMX27PC256-20NL
AT27C256R-20KM UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Atmel Corporation NMC27C256BQE200 vs AT27C256R-20KM

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