Memory
LC87C257-200V10
Intel Corporation
Description: UVPROM, 32KX8, 200ns, MOS, CDIP28, CERDIP-28

Overview of LC87C257-200V10 by Intel Corporation

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Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

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Part Data Attributes for LC87C257-200V10 by Intel Corporation

LC87C257-200V10
Intel Corporation
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEL CORP
Part Package Code
DIP
Package Description
WDIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
200 ns
JESD-30 Code
R-CDIP-T28
Length
35.56 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.44 mm
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
MOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. LC87C257-200V10
    Intel Corporation
    UVPROM, 32KX8, 200ns, MOS, CDIP28, CERDIP-28
    VS

Alternate Parts for LC87C257-200V10

This table gives cross-reference parts and alternative options found for LC87C257-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LC87C257-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM27C256-200DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LC87C257-200V10 vs AM27C256-200DCB
MBM27C256A-20WZ UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited LC87C257-200V10 vs MBM27C256A-20WZ
AS27C256-20JM UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components LC87C257-200V10 vs AS27C256-20JM
AM27C256-200DI UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion LC87C257-200V10 vs AM27C256-200DI
NM27C256QE200 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Rochester Electronics LLC LC87C257-200V10 vs NM27C256QE200
NMC27C256BQ200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation LC87C257-200V10 vs NMC27C256BQ200
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited LC87C257-200V10 vs MBM27C256A-20WZ
AM27C256-205DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LC87C257-200V10 vs AM27C256-205DC
27C256-20/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc LC87C257-200V10 vs 27C256-20/J
AS27C256-20JI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components LC87C257-200V10 vs AS27C256-20JI
Part Number Description Manufacturer Compare
AM27C256-150DE UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LC87C257-200V10 vs AM27C256-150DE
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation LC87C257-200V10 vs 27C256/BXA-20
LD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation LC87C257-200V10 vs LD27C256-200V10
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD LC87C257-200V10 vs AM27C256-205DCB
NMC27C256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation LC87C257-200V10 vs NMC27C256Q200
TD27256-20 UVPROM, 32KX8, 200ns, NMOS, CDIP28, CERDIP-28 Intel Corporation LC87C257-200V10 vs TD27256-20
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd LC87C257-200V10 vs FT27C256R-20LM
NMC27C256BN20 IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM National Semiconductor Corporation LC87C257-200V10 vs NMC27C256BN20
TMX27PC256-20NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments LC87C257-200V10 vs TMX27PC256-20NL
AT27C256R-20KM UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Atmel Corporation LC87C257-200V10 vs AT27C256R-20KM

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