Datasheets
27C512/BXA-20 by:

UVPROM, 64KX8, 200ns, CMOS, CDIP28

Part Details for 27C512/BXA-20 by YAGEO Corporation

Overview of 27C512/BXA-20 by YAGEO Corporation

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Applications Consumer Electronics Industrial Automation Renewable Energy Robotics and Drones

Part Details for 27C512/BXA-20

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27C512/BXA-20 Part Data Attributes

27C512/BXA-20 YAGEO Corporation
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27C512/BXA-20 YAGEO Corporation UVPROM, 64KX8, 200ns, CMOS, CDIP28
Part Life Cycle Code Obsolete
Ihs Manufacturer PHILIPS COMPONENTS
Package Description ,
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-CDIP-T28
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 27C512/BXA-20

This table gives cross-reference parts and alternative options found for 27C512/BXA-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C512/BXA-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 27C512/BXA-20 vs NM27P512QE200
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 27C512/BXA-20 vs CY27C512-200WC
NM27P512QM200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 27C512/BXA-20 vs NM27P512QM200
SMJ27C512-20JM UVPROM, 64KX8, 200ns, CMOS, CDIP28, DIP-28 Micross Components 27C512/BXA-20 vs SMJ27C512-20JM
NM27LC512Q200 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments 27C512/BXA-20 vs NM27LC512Q200
27C512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 27C512/BXA-20 vs 27C512-20/J
NM27P512QM200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 27C512/BXA-20 vs NM27P512QM200
SMJ27C512-20JM 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 Texas Instruments 27C512/BXA-20 vs SMJ27C512-20JM
NM27P512Q200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 27C512/BXA-20 vs NM27P512Q200
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 27C512/BXA-20 vs CY27C512-200WI
Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 27C512/BXA-20 vs AM27C512L-200DI
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion 27C512/BXA-20 vs AM27C512-200DC
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation 27C512/BXA-20 vs TD27C513-200V10
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 27C512/BXA-20 vs CY27C512-200WC
AM27C512-200DIB UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion 27C512/BXA-20 vs AM27C512-200DIB
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 27C512/BXA-20 vs NM27P512QE200
M27512-2F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics 27C512/BXA-20 vs M27512-2F1
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 27C512/BXA-20 vs 27LV512-20/J
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components 27C512/BXA-20 vs TMM27512AD-20
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 27C512/BXA-20 vs CY27C512-200WI

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