Datasheets
AM27C512-200DIB by:

UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for AM27C512-200DIB by Spansion

Overview of AM27C512-200DIB by Spansion

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Applications Consumer Electronics

Part Details for AM27C512-200DIB

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AM27C512-200DIB Part Data Attributes

AM27C512-200DIB Spansion
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AM27C512-200DIB Spansion UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SPANSION INC
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28
JESD-609 Code e0
Length 37.147 mm
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27C512-200DIB

This table gives cross-reference parts and alternative options found for AM27C512-200DIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C512-200DIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion AM27C512-200DIB vs AM27C512-200DC
M27C512-20F3 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics AM27C512-200DIB vs M27C512-20F3
AM27C512L-200DE UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C512-200DIB vs AM27C512L-200DE
NMC27C512AQ200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments AM27C512-200DIB vs NMC27C512AQ200
M27C512-20F1 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics AM27C512-200DIB vs M27C512-20F1
NMC27C512AQ200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C512-200DIB vs NMC27C512AQ200
LD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation AM27C512-200DIB vs LD27C513-200V10
MSM27512-20AS UVPROM, 64KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 OKI Electric Industry Co Ltd AM27C512-200DIB vs MSM27512-20AS
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C512-200DIB vs 27LV512-20/J
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation AM27C512-200DIB vs TD27C513-200V10
Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C512-200DIB vs AM27C512L-200DI
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion AM27C512-200DIB vs AM27C512-200DC
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation AM27C512-200DIB vs TD27C513-200V10
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor AM27C512-200DIB vs CY27C512-200WC
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C512-200DIB vs NM27P512QE200
M27512-2F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics AM27C512-200DIB vs M27512-2F1
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C512-200DIB vs 27LV512-20/J
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components AM27C512-200DIB vs TMM27512AD-20
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor AM27C512-200DIB vs CY27C512-200WI
NM27P512QM200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C512-200DIB vs NM27P512QM200

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