Datasheets
SMJ27C512-20JM by:

UVPROM, 64KX8, 200ns, CMOS, CDIP28, DIP-28

Part Details for SMJ27C512-20JM by Micross Components

Overview of SMJ27C512-20JM by Micross Components

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Applications Space Technology Computing and Data Storage Aerospace and Defense

Price & Stock for SMJ27C512-20JM

Part # Distributor Description Stock Price Buy
DISTI # 5962-8764802XA
Avnet Americas EPROM UV 512K-Bit 64K x 8 200ns 28-Pin CDIP - Bulk (Alt: 5962-8764802XA) RoHS: Compliant Min Qty: 25 Package Multiple: 25 Lead time: 30 Weeks, 0 Days Container: Bulk 0
RFQ

Part Details for SMJ27C512-20JM

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SMJ27C512-20JM Part Data Attributes

SMJ27C512-20JM Micross Components
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SMJ27C512-20JM Micross Components UVPROM, 64KX8, 200ns, CMOS, CDIP28, DIP-28
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code DIP
Package Description DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Factory Lead Time 30 Weeks
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.8928 mm
Standby Current-Max 0.000325 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for SMJ27C512-20JM

This table gives cross-reference parts and alternative options found for SMJ27C512-20JM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SMJ27C512-20JM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation SMJ27C512-20JM vs NM27P512QE200
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor SMJ27C512-20JM vs CY27C512-200WC
NM27P512QM200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation SMJ27C512-20JM vs NM27P512QM200
NM27LC512Q200 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments SMJ27C512-20JM vs NM27LC512Q200
27C512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc SMJ27C512-20JM vs 27C512-20/J
NM27P512QM200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments SMJ27C512-20JM vs NM27P512QM200
SMJ27C512-20JM 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 Texas Instruments SMJ27C512-20JM vs SMJ27C512-20JM
NM27P512Q200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments SMJ27C512-20JM vs NM27P512Q200
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor SMJ27C512-20JM vs CY27C512-200WI
27C512-20I/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc SMJ27C512-20JM vs 27C512-20I/J
Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD SMJ27C512-20JM vs AM27C512L-200DI
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion SMJ27C512-20JM vs AM27C512-200DC
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation SMJ27C512-20JM vs TD27C513-200V10
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor SMJ27C512-20JM vs CY27C512-200WC
AM27C512-200DIB UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion SMJ27C512-20JM vs AM27C512-200DIB
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation SMJ27C512-20JM vs NM27P512QE200
M27512-2F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics SMJ27C512-20JM vs M27512-2F1
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc SMJ27C512-20JM vs 27LV512-20/J
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components SMJ27C512-20JM vs TMM27512AD-20
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor SMJ27C512-20JM vs CY27C512-200WI

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