Datasheets
NM27P512Q200 by:

64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for NM27P512Q200 by Texas Instruments

Overview of NM27P512Q200 by Texas Instruments

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for NM27P512Q200

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NM27P512Q200 Part Data Attributes

NM27P512Q200 Texas Instruments
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NM27P512Q200 Texas Instruments 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for NM27P512Q200

This table gives cross-reference parts and alternative options found for NM27P512Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27P512Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NM27P512Q200 vs NM27P512QE200
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor NM27P512Q200 vs CY27C512-200WC
NM27P512QM200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NM27P512Q200 vs NM27P512QM200
SMJ27C512-20JM UVPROM, 64KX8, 200ns, CMOS, CDIP28, DIP-28 Micross Components NM27P512Q200 vs SMJ27C512-20JM
NM27LC512Q200 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments NM27P512Q200 vs NM27LC512Q200
27C512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NM27P512Q200 vs 27C512-20/J
NM27P512QM200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments NM27P512Q200 vs NM27P512QM200
SMJ27C512-20JM 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 Texas Instruments NM27P512Q200 vs SMJ27C512-20JM
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor NM27P512Q200 vs CY27C512-200WI
27C512-20I/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NM27P512Q200 vs 27C512-20I/J
Part Number Description Manufacturer Compare
AM27C512L-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NM27P512Q200 vs AM27C512L-200DI
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion NM27P512Q200 vs AM27C512-200DC
TD27C513-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation NM27P512Q200 vs TD27C513-200V10
CY27C512-200WC UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor NM27P512Q200 vs CY27C512-200WC
AM27C512-200DIB UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion NM27P512Q200 vs AM27C512-200DIB
NM27P512QE200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NM27P512Q200 vs NM27P512QE200
M27512-2F1 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics NM27P512Q200 vs M27512-2F1
27LV512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NM27P512Q200 vs 27LV512-20/J
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components NM27P512Q200 vs TMM27512AD-20
CY27C512-200WI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor NM27P512Q200 vs CY27C512-200WI

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