XC3S1000-4FG456I vs XC3S1000-4FG456I0974 feature comparison

XC3S1000-4FG456I AMD Xilinx

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XC3S1000-4FG456I0974 AMD Xilinx

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, FBGA-456 BGA,
Pin Count 456 456
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 35 Weeks
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of CLBs 1920 1920
Number of Equivalent Gates 1000000 1000000
Number of Inputs 333
Number of Logic Cells 17280
Number of Outputs 333
Number of Terminals 456 456
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS, 1000000 GATES 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
Base Number Matches 2 1

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Compare XC3S1000-4FG456I0974 with alternatives