XC3S1000-4FG456I0974 vs XC3S700A-4FG484C feature comparison

XC3S1000-4FG456I0974 AMD Xilinx

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XC3S700A-4FG484C AMD Xilinx

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, FBGA-484
Pin Count 456 484
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 630 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.71 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Number of CLBs 1920 1472
Number of Equivalent Gates 1000000 700000
Number of Terminals 456 484
Organization 1920 CLBS, 1000000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
ECCN Code 3A991.D
Factory Lead Time 35 Weeks
Moisture Sensitivity Level 3
Number of Inputs 372
Number of Logic Cells 13248
Number of Outputs 288
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA484,22X22,40
Peak Reflow Temperature (Cel) 225
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3S1000-4FG456I0974 with alternatives

Compare XC3S700A-4FG484C with alternatives