XC3S1000-4FG456I
vs
XC3S700AN-5FG484C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
23 X 23 MM, FBGA-456
FBGA-484
Pin Count
456
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Factory Lead Time
35 Weeks
Clock Frequency-Max
630 MHz
770 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
0.62 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B484
JESD-609 Code
e0
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1920
1472
Number of Equivalent Gates
1000000
700000
Number of Inputs
333
372
Number of Logic Cells
17280
13248
Number of Outputs
333
288
Number of Terminals
456
484
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1920 CLBS, 1000000 GATES
1472 CLBS, 700000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
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