XC3S1000-4FG456I0974
vs
XC3S1000L-4FGG456C
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
LEAD FREE, FBGA-456
|
| Pin Count |
456
|
456
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
630 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.61 ns
|
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| JESD-609 Code |
e0
|
e1
|
| Length |
23 mm
|
23 mm
|
| Number of CLBs |
1920
|
1920
|
| Number of Equivalent Gates |
1000000
|
1000000
|
| Number of Terminals |
456
|
456
|
| Organization |
1920 CLBS, 1000000 GATES
|
1920 CLBS, 1000000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| Number of Inputs |
|
333
|
| Number of Logic Cells |
|
17280
|
| Number of Outputs |
|
333
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA456,22X22,40
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Temperature Grade |
|
OTHER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC3S1000-4FG456I0974 with alternatives
Compare XC3S1000L-4FGG456C with alternatives