XC3S1000-4FG456I vs XC3S1000L-4FGG456C feature comparison

XC3S1000-4FG456I AMD Xilinx

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XC3S1000L-4FGG456C AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, FBGA-456 LEAD FREE, FBGA-456
Pin Count 456 456
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 35 Weeks
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1920
Number of Equivalent Gates 1000000 1000000
Number of Inputs 333 333
Number of Logic Cells 17280 17280
Number of Outputs 333 333
Number of Terminals 456 456
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS, 1000000 GATES 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 1

Compare XC3S1000-4FG456I with alternatives

Compare XC3S1000L-4FGG456C with alternatives