WSF512K16-39H2CA
vs
WSE128K16-73H1M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
PGA
PGA
Package Description
1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66
PGA,
Pin Count
66
66
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
SRAM IS ORGANISED AS 512K X 16
ALSO CONTAINS 128K X 16 BIT SRAM
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
JESD-609 Code
e0
e4
Length
35.2 mm
27.3 mm
Memory Density
8388608 bit
2097152 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX16
128KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
4.34 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
35.2 mm
27.3 mm
Base Number Matches
1
2
Pbfree Code
Compare WSF512K16-39H2CA with alternatives
Compare WSE128K16-73H1M with alternatives