Part Details for WSF512K16-39H2CA by Microsemi Corporation
Overview of WSF512K16-39H2CA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WSF512K16-39H2CA
WSF512K16-39H2CA CAD Models
WSF512K16-39H2CA Part Data Attributes
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WSF512K16-39H2CA
Microsemi Corporation
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Datasheet
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WSF512K16-39H2CA
Microsemi Corporation
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | PGA | |
| Package Description | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | SRAM IS ORGANISED AS 512K X 16 | |
| JESD-30 Code | S-CPGA-P66 | |
| JESD-609 Code | e0 | |
| Length | 35.2 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX16 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.7 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 35.2 mm |
Alternate Parts for WSF512K16-39H2CA
This table gives cross-reference parts and alternative options found for WSF512K16-39H2CA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WSF512K16-39H2CA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| WSF512K16-39H2IA | Microsemi Corporation | Check for Price | Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 | WSF512K16-39H2CA vs WSF512K16-39H2IA |
| 5962-9690102HXA | White Microelectronics | Check for Price | Memory Circuit, 512KX16, CMOS, CHIP66, | WSF512K16-39H2CA vs 5962-9690102HXA |
| 5962-9690102HXC | White Microelectronics | Check for Price | Memory Circuit, 512KX16, CMOS, CHIP66, | WSF512K16-39H2CA vs 5962-9690102HXC |
| ACT-SF512K16N-39P7Q | Cobham Power Products | Check for Price | Memory Circuit, 512KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | WSF512K16-39H2CA vs ACT-SF512K16N-39P7Q |
| WSF512K16-39H2C | Microsemi Corporation | Check for Price | Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 | WSF512K16-39H2CA vs WSF512K16-39H2C |