WSE128K16-73H1M
vs
WSE128K16-73G2TIA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
WHITE MICROELECTRONICS
MICROSEMI CORP
Package Description
CERAMIC, HIP-66
,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
ALSO CONTAINS 128K X 16 BIT SRAM
ALSO CONTAINS 128K X 16 BIT SRAM
JESD-30 Code
S-CHIP-P66
S-CQMA-G68
Memory Density
2097152 bit
2097152 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
66
68
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
128KX16
128KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
GULL WING
Terminal Position
HEX
QUAD
Base Number Matches
3
3
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
68
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare WSE128K16-73G2TIA with alternatives